Manufacturing Technology

Vertech Partners With CESMII To Expand Their Strategic Focus on Smart Manufacturing

Vertech Partners With CESMII To Expand Their Strategic Focus on Smart Manufacturing

Vertech, an innovative systems integrator with a wide breadth of services and offerings with locations in Arizona, California, Tennessee and Texas, has joined as the newest member of CESMII, the Smart Manufacturing Institute.

Specializing in industrial automation and information solutions, including SCADA, MES and OT among others, Vertech bolsters the CESMII stable of innovators in the organization’s drive to improve digital manufacturing enterprise.

“In our ongoing effort to democratize and improve access to smart manufacturing practices, we’re always looking for innovative, aggressive companies that can help us continue to evolve and grow,” said John Dyck, CESMII CEO. “We’re excited to have an industry changemaker like Vertech join us to help advance the adoption of smart manufacturing across the U.S.”

Vertech offers next-generation automation services to a number of vertical markets, including food and beverage, solar energy, water/wastewater, airports and general manufacturing. They look forward to partnering with CESMII to leverage their vendor-agnostic tools, capabilities and methodologies, as well as technology strategies that support interoperability and a focus on reducing complexity, cost and the total cost of ownership for their clients.

They also plan on leveraging CESMII’s Smart Manufacturing Business Assessment which helps clients develop future-proof manufacturing strategies and roadmaps to put their smart manufacturing journey on the right path.

“It’s no secret that smart manufacturing represents how organizations will succeed in the coming years and decades,” said Titus Crabb, Vertech CEO. “And partnering with CESMII allows us to put our best foot forward by collaborating with the best and brightest minds in the smart manufacturing space. We’re looking forward to building great things as part of CESMII.”

About Vertech

Vertech is a well-respected systems integrator with a wide range of expertise across the manufacturing spectrum. The company is dedicated to elevating human well-being through automation and championing the smart manufacturing movement. Vertech achieves this by improving operational efficiency, visibility, and security using top-tier automation, SCADA, MES, and OT network solutions. The company works across a variety of vertical markets, offering services such as mobile-first design, full-process control, real-time data monitoring, efficiency tracking (OEE) and maintenance management (CMMS). For more information, visit vertech.com.

About CESMII

CESMII – the Smart Manufacturing Institute – has a total investment of $140M from Department of Energy funding and public/private partnership contributions, with a mandate to create a more competitive manufacturing environment here in the US. CESMII is one of 16 Manufacturing USA institutes on this mission to increase manufacturing productivity, global competitiveness, and reinvestment by increasing energy productivity, improving economic performance and raising workforce capacity. University of California at Los Angeles (UCLA) is the program and administrative home of CESMII.

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MaxLinear Launches Product Design Kit for Active Electrical Cables Using Keystone PAM4 DSP

MaxLinear | February 02, 2024

MaxLinear, Inc. a leading provider of high-speed interconnect ICs enabling data center, metro, and wireless transport networks, announced the availability of a comprehensive product design kit (PDK) to optimize performance and accelerate the time to market for high-speed Active Electrical Cables (AEC) using MaxLinear’s 5nm PAM4 DSP, Keystone. The PDK is a cost-cutting and time-saving tool for cable manufacturers who want to quickly integrate Keystone into their active electrical cables. MaxLinear’s Keystone PAM4 DSP offers a significant power advantage in AEC applications, which is increasingly becoming a critical factor for hyperscale data centers. The use of 5nm CMOS technology enables designers and manufacturers to build high-speed cables that meet the need for low power, highly integrated, high performance interconnect solutions that will drive the next generation of hyperscale cloud networks. Manufacturers taking advantage of MaxLinear’s PDK to optimize cable designs using Keystone PAM4 DSP will gain a distinct advantage over competitor solutions when trying to maximize reach and minimize power consumption. The PDK makes Keystone easy to integrate with strong applications support, multiple tools to optimize and monitor performance, and reference designs (SW and HW) to accelerate integration. Sophisticated software allows for quick design optimization for the lowest possible power consumption and maximizing cable reach. Cable designers can constantly monitor performance, route signals from any port to any port, and take advantage of hitless firmware upgrades. “MaxLinear is focused on providing not only industry-leading interconnect technologies but also a comprehensive suite of tools to support our manufacturing and design partners,” said Drew Guckenberger, Vice President of High Speed Interconnect at MaxLinear. “Our development kit for our Keystone products provides them with a path to take products to market more quickly and more cost-effectively.” Active electrical cables (AECs) are revolutionizing data center connections. Unlike passive cables, they actively boost signals, allowing for longer distances (up to 7 meters for 400G), higher bandwidth, and thinner, lighter cables. This makes them ideal for high-speed applications like top-of-rack connections (connecting switches to servers within the same rack); direct digital control (enabling flexible interconnectivity within racks and across rows); and breakout solutions (splitting high-speed connections into multiple lower-speed channels). The high-speed interconnect market – which includes active optical cables, active electrical cables, direct attach copper cables, and others – is expected to grow to $17.1B by 2028, up from $10.7B in 2021 according to a market forecast report from The Insight Partners. The Keystone Family The Keystone 5nm DSP family caters to 400G and 800G applications, featuring a groundbreaking 106.25Gbps host side electrical I/O, aligning with the line side interface rate. Available variants support single-mode optics (EML and SiPh), multimode optics and Active Electrical Cables (AECs), offering comprehensive solutions with companion TIAs. Host side interfaces cover ethernet rates of 25G, 50G, and 100G per lane over C2M, MR, and LR host channels. The line side interfaces, tailored for 100G/λ DR, FR, and LR applications, also support these rates. These devices boast extensive DSP functionality, encompassing line-side transmitter DPD, TX FIR, receiver FFE, and DFE. With exceptional performance and signal integrity, these DSPs occupy a compact footprint (12mm x 13mm), ideal for next-gen module form-factors like QSFP-DD800 and OSFP800. Additionally, they are available as Known Good Die (KGD) for denser applications, such as OSFP-XD. About MaxLinear, Inc. MaxLinear, Inc. is a leading provider of radio frequency (RF), analog, digital, and mixed-signal integrated circuits for access and connectivity, wired and wireless infrastructure, and industrial and multimarket applications. MaxLinear is headquartered in Carlsbad, California. MaxLinear, the MaxLinear logo, any other MaxLinear trademarks are all property of MaxLinear, Inc. or one of MaxLinear's subsidiaries in the U.S.A. and other countries. All rights reserved.

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