The New MCU Portfolio Redefines Microcontroller Performance, Enabling 10 Times the Processing Capacity of Existing Devices

Texas Instruments today launched a new high-performance microcontroller (MCU) portfolio designed to accelerate real-time control, networking, and analytics applications at the edge. Engineers can achieve ten times the computing capability of conventional flash-based MCUs with the new Sitara AM2x MCUs. This high-performance portfolio bridges the increasing performance gap between today's MCUs and Processors, allowing designers to push the limits in applications like industrial automation, robotics, automotive systems, and sustainable energy management.

The Sitara AM2x MCU portfolio is based on high-performance Arm MCU cores. It comprises single and multicore devices that operate at speeds of up to 1 GHz and incorporate specialized peripherals and accelerators. Implementing high-performance processing capabilities has never been easier, due to widely accessible tools and user-friendly software that simplifies evaluation while lowering overall design complexity and expense.

Processor-level performance in a power-efficient MCU

The AM243x MCUs, the first family of devices in the AM2x portfolio, have up to four Arm Cortex-R5F cores operating at 800 MHz each. This high processing speed is important in industrial equipment such as robotics, where fast computations combined with the MCU's internal memory improve a robot's accuracy of motion and speed of movement, resulting in increased production. In addition, the increased processing power allows designers to include analytics for tasks such as predictive maintenance, reducing downtime on manufacturing floors. In typical applications, AM243x devices can reach this level of performance while using less than 1 W of active power, allowing factory owners to expand their power resources while reducing their operational costs and energy footprint.

Integration brings real-time control and networking to the edge.

Sitara AM243x MCUs provide sensor and actuation peripherals for low-latency real-time processing and control in factory automation and communications accelerators for simplified industrial networking. AM243x devices extend TI's support for several gigabit industrial Ethernet protocols and time-sensitive networking (TSN), allowing next-generation factory networks. Engineers can use AM243x to handle EtherNet/IPTM, EtherCAT, PROFINET, IO-Link Master, and other emerging industrial communication protocols using certified protocol stacks available directly from TI. In addition, the AM243x MCUs' on-chip security features support the most current encryption requirements, and integrated functional safety mechanisms, diagnostics, and collateral assistance enable system integrators to target up to Safety Integrity Level (SIL) 3 of the IEC 61508 standard with their industrial designs.

High-performance designs can be made easier using widely accessible tools and software.

TI created the Sitara AM243x LaunchPadDevelopment Kit to simplify the complexity of design and development, allowing for the quick evaluation of high-performance MCUs for less than $100. With this assessment tool and the Sitara MCU+ software framework, developers can instantly begin utilizing the AM243x MCU's precise real-time control and out-of-the-box networking features. Developers can also use application-specific reference examples, a comprehensive ecosystem of tools and software, and the MCU+ Academy training site to simplify designs and save time to market.

Package, price, and availability

The AM2431, AM2432, and AM2434 are now available exclusively on TI.com in 17-mm-by-17-mm or 11-mm-by-11-mm packages. For 1,000 units, pricing begins at $6.05 USD. In addition, the AM243x LaunchPad Development Kit is also available for purchase on TI.com for $89 USD.

About Texas Instruments

Texas Instruments Incorporated is a global semiconductor company that develops, manufactures, tests, and sells analog and embedded processor chips for applications such as industrial, automotive, personal electronics, communications equipment, and enterprise systems. Our passion for making electronics more affordable through semiconductors is alive and well today, as each generation of innovation builds on the previous to make our technology smaller, more efficient, more reliable, and more affordable – allowing semiconductors to be used in electronics everywhere. This is known as Engineering Progress. It's what we've been doing for decades.

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MaxLinear Launches Product Design Kit for Active Electrical Cables Using Keystone PAM4 DSP

MaxLinear | February 02, 2024

MaxLinear, Inc. a leading provider of high-speed interconnect ICs enabling data center, metro, and wireless transport networks, announced the availability of a comprehensive product design kit (PDK) to optimize performance and accelerate the time to market for high-speed Active Electrical Cables (AEC) using MaxLinear’s 5nm PAM4 DSP, Keystone. The PDK is a cost-cutting and time-saving tool for cable manufacturers who want to quickly integrate Keystone into their active electrical cables. MaxLinear’s Keystone PAM4 DSP offers a significant power advantage in AEC applications, which is increasingly becoming a critical factor for hyperscale data centers. The use of 5nm CMOS technology enables designers and manufacturers to build high-speed cables that meet the need for low power, highly integrated, high performance interconnect solutions that will drive the next generation of hyperscale cloud networks. Manufacturers taking advantage of MaxLinear’s PDK to optimize cable designs using Keystone PAM4 DSP will gain a distinct advantage over competitor solutions when trying to maximize reach and minimize power consumption. The PDK makes Keystone easy to integrate with strong applications support, multiple tools to optimize and monitor performance, and reference designs (SW and HW) to accelerate integration. Sophisticated software allows for quick design optimization for the lowest possible power consumption and maximizing cable reach. Cable designers can constantly monitor performance, route signals from any port to any port, and take advantage of hitless firmware upgrades. “MaxLinear is focused on providing not only industry-leading interconnect technologies but also a comprehensive suite of tools to support our manufacturing and design partners,” said Drew Guckenberger, Vice President of High Speed Interconnect at MaxLinear. “Our development kit for our Keystone products provides them with a path to take products to market more quickly and more cost-effectively.” Active electrical cables (AECs) are revolutionizing data center connections. Unlike passive cables, they actively boost signals, allowing for longer distances (up to 7 meters for 400G), higher bandwidth, and thinner, lighter cables. This makes them ideal for high-speed applications like top-of-rack connections (connecting switches to servers within the same rack); direct digital control (enabling flexible interconnectivity within racks and across rows); and breakout solutions (splitting high-speed connections into multiple lower-speed channels). The high-speed interconnect market – which includes active optical cables, active electrical cables, direct attach copper cables, and others – is expected to grow to $17.1B by 2028, up from $10.7B in 2021 according to a market forecast report from The Insight Partners. The Keystone Family The Keystone 5nm DSP family caters to 400G and 800G applications, featuring a groundbreaking 106.25Gbps host side electrical I/O, aligning with the line side interface rate. Available variants support single-mode optics (EML and SiPh), multimode optics and Active Electrical Cables (AECs), offering comprehensive solutions with companion TIAs. Host side interfaces cover ethernet rates of 25G, 50G, and 100G per lane over C2M, MR, and LR host channels. The line side interfaces, tailored for 100G/λ DR, FR, and LR applications, also support these rates. These devices boast extensive DSP functionality, encompassing line-side transmitter DPD, TX FIR, receiver FFE, and DFE. With exceptional performance and signal integrity, these DSPs occupy a compact footprint (12mm x 13mm), ideal for next-gen module form-factors like QSFP-DD800 and OSFP800. Additionally, they are available as Known Good Die (KGD) for denser applications, such as OSFP-XD. About MaxLinear, Inc. MaxLinear, Inc. is a leading provider of radio frequency (RF), analog, digital, and mixed-signal integrated circuits for access and connectivity, wired and wireless infrastructure, and industrial and multimarket applications. MaxLinear is headquartered in Carlsbad, California. MaxLinear, the MaxLinear logo, any other MaxLinear trademarks are all property of MaxLinear, Inc. or one of MaxLinear's subsidiaries in the U.S.A. and other countries. All rights reserved.

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