Digital Transformation

NVIDIA Partners With Foxconn to Build Factories and Systems for the AI Industrial Revolution

NVIDIA Partners With Foxconn to Build Factories and Systems

NVIDIA today announced that it is collaborating with Hon Hai Technology Group (Foxconn) to accelerate the AI industrial revolution.

Foxconn will integrate NVIDIA technology to develop a new class of data centers powering a wide range of applications — including digitalization of manufacturing and inspection workflows, development of AI-powered electric vehicle and robotics platforms, and a growing number of language-based generative AI services.

Announced in a fireside chat with NVIDIA founder and CEO Jensen Huang and Foxconn Chairman and CEO Young Liu at Hon Hai Tech Day, in Taipei, the collaboration starts with the creation of AI factories — an NVIDIA® GPU computing infrastructure specially built for processing, refining and transforming vast amounts of data into valuable AI models and tokens — based on the NVIDIA accelerated computing platform, including the latest NVIDIA GH200 Grace Hopper™ Superchip and NVIDIA AI Enterprise software.

Foxconn is also developing its smart solution platforms based on NVIDIA technologies:

  • Foxconn Smart EV will be built on NVIDIA DRIVE Hyperion™ 9, a next-generation platform for autonomous automotive fleets, powered by NVIDIA DRIVE Thor™, its future automotive systems-on-a-chip.
  • Foxconn Smart Manufacturing robotic systems will be built on the NVIDIA Isaac™ autonomous mobile robot platform.
  • Foxconn Smart City will incorporate the NVIDIA Metropolis intelligent video analytics platform.

Most importantly, NVIDIA and Foxconn are building these factories together. We will be helping the whole industry move much faster into the new AI era, said Foxconn Chairman and CEO Young Liu.

“A new type of manufacturing has emerged — the production of intelligence. And the data centers that produce it are AI factories,” said Huang. “Foxconn, the world’s largest manufacturer, has the expertise and scale to build AI factories globally. We are delighted to expand our decade-long partnership with Foxconn to accelerate the AI industrial revolution.”

Enabling Foxconn Customers to Build AI Data Factories

Working closely with NVIDIA, Foxconn is expected to build a large number of systems based on NVIDIA CPUs, GPUs and networking for its global customer base, which is looking to create and operate their own AI factories, optimized with NVIDIA AI Enterprise software.

Among the key NVIDIA technologies Foxconn is using to create these custom designs are NVIDIA HGX™ reference designs featuring eight NVIDIA H100 Tensor Core GPUs per system, NVIDIA GH200 Superchips, NVIDIA OVX™ reference designs and NVIDIA networking.

With these systems, Foxconn customers can leverage NVIDIA accelerated computing to deliver generative AI services as well as use simulation to speed up the training of autonomous machines, including industrial robots and self-driving cars.

Foxconn Eyes Potential AI Factory

In addition to equipping its customers with NVIDIA technology-powered AI factories, Foxconn is eyeing its own that will tap into the NVIDIA Omniverse™ platform and Isaac and Metropolis frameworks to meet the strict production and quality standards of the electronics industry.

Advances in edge AI and simulation are enabling deployment of autonomous mobile robots that can travel several miles a day and industrial robots for assembling components, applying coatings, packaging and performing quality inspections.

An AI factory with these NVIDIA platforms can give Foxconn the ability to accomplish AI training and inference, enhance factory workflows and run simulations in the virtual world before deployment in the physical world. Simulating the entire robotics and automation pipeline from end to end provides Foxconn with a path to operational efficiency gains, saving time and costs.

Developing Safe, AI-Powered EVs

Foxconn will also deliver a range of NVIDIA DRIVE™ solutions to global automakers, serving as a tier-one manufacturer of NVIDIA DRIVE Orin™-based electronic control units (ECUs) today and scaling to NVIDIA DRIVE Thor-based ECUs in the future.

As a contract manufacturer, Foxconn will offer highly automated and autonomous, AI-rich EVs featuring the upcoming NVIDIA DRIVE Hyperion 9 platform, which includes DRIVE Thor and a state-of-the-art sensor architecture. This will enable Foxconn and its automotive customers to realize a new era of functionally safe and secure software-defined cars.

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MaxLinear Launches Product Design Kit for Active Electrical Cables Using Keystone PAM4 DSP

MaxLinear | February 02, 2024

MaxLinear, Inc. a leading provider of high-speed interconnect ICs enabling data center, metro, and wireless transport networks, announced the availability of a comprehensive product design kit (PDK) to optimize performance and accelerate the time to market for high-speed Active Electrical Cables (AEC) using MaxLinear’s 5nm PAM4 DSP, Keystone. The PDK is a cost-cutting and time-saving tool for cable manufacturers who want to quickly integrate Keystone into their active electrical cables. MaxLinear’s Keystone PAM4 DSP offers a significant power advantage in AEC applications, which is increasingly becoming a critical factor for hyperscale data centers. The use of 5nm CMOS technology enables designers and manufacturers to build high-speed cables that meet the need for low power, highly integrated, high performance interconnect solutions that will drive the next generation of hyperscale cloud networks. Manufacturers taking advantage of MaxLinear’s PDK to optimize cable designs using Keystone PAM4 DSP will gain a distinct advantage over competitor solutions when trying to maximize reach and minimize power consumption. The PDK makes Keystone easy to integrate with strong applications support, multiple tools to optimize and monitor performance, and reference designs (SW and HW) to accelerate integration. Sophisticated software allows for quick design optimization for the lowest possible power consumption and maximizing cable reach. Cable designers can constantly monitor performance, route signals from any port to any port, and take advantage of hitless firmware upgrades. “MaxLinear is focused on providing not only industry-leading interconnect technologies but also a comprehensive suite of tools to support our manufacturing and design partners,” said Drew Guckenberger, Vice President of High Speed Interconnect at MaxLinear. “Our development kit for our Keystone products provides them with a path to take products to market more quickly and more cost-effectively.” Active electrical cables (AECs) are revolutionizing data center connections. Unlike passive cables, they actively boost signals, allowing for longer distances (up to 7 meters for 400G), higher bandwidth, and thinner, lighter cables. This makes them ideal for high-speed applications like top-of-rack connections (connecting switches to servers within the same rack); direct digital control (enabling flexible interconnectivity within racks and across rows); and breakout solutions (splitting high-speed connections into multiple lower-speed channels). The high-speed interconnect market – which includes active optical cables, active electrical cables, direct attach copper cables, and others – is expected to grow to $17.1B by 2028, up from $10.7B in 2021 according to a market forecast report from The Insight Partners. The Keystone Family The Keystone 5nm DSP family caters to 400G and 800G applications, featuring a groundbreaking 106.25Gbps host side electrical I/O, aligning with the line side interface rate. Available variants support single-mode optics (EML and SiPh), multimode optics and Active Electrical Cables (AECs), offering comprehensive solutions with companion TIAs. Host side interfaces cover ethernet rates of 25G, 50G, and 100G per lane over C2M, MR, and LR host channels. The line side interfaces, tailored for 100G/λ DR, FR, and LR applications, also support these rates. These devices boast extensive DSP functionality, encompassing line-side transmitter DPD, TX FIR, receiver FFE, and DFE. With exceptional performance and signal integrity, these DSPs occupy a compact footprint (12mm x 13mm), ideal for next-gen module form-factors like QSFP-DD800 and OSFP800. Additionally, they are available as Known Good Die (KGD) for denser applications, such as OSFP-XD. About MaxLinear, Inc. MaxLinear, Inc. is a leading provider of radio frequency (RF), analog, digital, and mixed-signal integrated circuits for access and connectivity, wired and wireless infrastructure, and industrial and multimarket applications. MaxLinear is headquartered in Carlsbad, California. MaxLinear, the MaxLinear logo, any other MaxLinear trademarks are all property of MaxLinear, Inc. or one of MaxLinear's subsidiaries in the U.S.A. and other countries. All rights reserved.

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