Manufacturing Technology

MLC CAD Systems Partners with Formlabs to Expand Additive Manufacturing Solutions

MLC CAD Systems Partners with Formlabs to Expand Additive Manufacturing Solutions

MLC CAD Systems LLC, announced today a new partnership with Formlabs, the leading 3D printing company. This partnership expands upon existing manufacturing technology and expertise to provide access to new additive solutions, including SLA (stereolithography) and SLS (selective laser sintering). Formlabs has a proven history of delivering reliable 3D printers and industrial-grade materials that are easy to use and affordable.

“Formlabs is a great complement to our growing comprehensive technology solutions suite focused on customer success,” says MLC’s Sales Director Kevin Schreiner. “With a proven record of delivering easy-to-use 3D printers that are affordable and reliable, the partnership was an easy decision for MLC. Success in Engineering and Manufacturing goes beyond hardware and software. We carefully select the products we offer and combine them with over 40 years of Unbeatable Service, training, and expertise to deliver complete solutions to our customers.”

“Partnering with MLC CAD Systems further expands Formlabs’ ability to enable anyone to make anything,” said Brian Nies, Head of North American Sales at Formlabs. “By making our ecosystem of 3D printers, materials, and new advancements like the Form Auto available to MLC’s customers, Formlabs has another great avenue for enabling manufacturers across the country to use additive manufacturing to advance prototyping, in-house manufacturing, and production efforts.”

This partnership expands local availability of sales and support for Formlabs by adding MLC’s 27 offices and training centers across the USA. Additive manufacturing showrooms will initially be located in Dallas & Austin, TX, and Atlanta, GA.

About MLC CAD Systems

At MLC CAD Systems, we provide Unbeatable Service, backed by decades of industry experience. We offer our customers the best in 3D design, subtractive, and additive solutions from Formlabs, SOLIDWORKS, Mastercam, and Markforged, along with the support of our award-winning application experts. From concept to production, we’re with you every step of the way. Learn more at https://mlc-cad.com/.

About Formlabs

Formlabs is expanding access to digital fabrication, so anyone can make anything.

Headquartered in Somerville, Massachusetts with offices in Germany, Japan, China, Singapore, Hungary, and North Carolina, Formlabs is the professional 3D printer of choice for engineers, designers, manufacturers, and decision makers around the globe. Formlabs products include the Form 3+, Form 3B+ and Form 3L, powered by an advanced form of stereolithography (SLA) called Low Force Stereolithography (LFS)™ 3D printing, Form 2 SLA 3D printer, Form Wash and Form Cure post-processing solutions, Fuse 1 SLS 3D printer, and Form Auto manufacturing solution. Formlabs also develops its own suite of high-performance materials that continue to push the boundaries for 3D printing, as well as best-in-class 3D printing software. Visit https://formlabs.com/.

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MaxLinear Launches Product Design Kit for Active Electrical Cables Using Keystone PAM4 DSP

MaxLinear | February 02, 2024

MaxLinear, Inc. a leading provider of high-speed interconnect ICs enabling data center, metro, and wireless transport networks, announced the availability of a comprehensive product design kit (PDK) to optimize performance and accelerate the time to market for high-speed Active Electrical Cables (AEC) using MaxLinear’s 5nm PAM4 DSP, Keystone. The PDK is a cost-cutting and time-saving tool for cable manufacturers who want to quickly integrate Keystone into their active electrical cables. MaxLinear’s Keystone PAM4 DSP offers a significant power advantage in AEC applications, which is increasingly becoming a critical factor for hyperscale data centers. The use of 5nm CMOS technology enables designers and manufacturers to build high-speed cables that meet the need for low power, highly integrated, high performance interconnect solutions that will drive the next generation of hyperscale cloud networks. Manufacturers taking advantage of MaxLinear’s PDK to optimize cable designs using Keystone PAM4 DSP will gain a distinct advantage over competitor solutions when trying to maximize reach and minimize power consumption. The PDK makes Keystone easy to integrate with strong applications support, multiple tools to optimize and monitor performance, and reference designs (SW and HW) to accelerate integration. Sophisticated software allows for quick design optimization for the lowest possible power consumption and maximizing cable reach. Cable designers can constantly monitor performance, route signals from any port to any port, and take advantage of hitless firmware upgrades. “MaxLinear is focused on providing not only industry-leading interconnect technologies but also a comprehensive suite of tools to support our manufacturing and design partners,” said Drew Guckenberger, Vice President of High Speed Interconnect at MaxLinear. “Our development kit for our Keystone products provides them with a path to take products to market more quickly and more cost-effectively.” Active electrical cables (AECs) are revolutionizing data center connections. Unlike passive cables, they actively boost signals, allowing for longer distances (up to 7 meters for 400G), higher bandwidth, and thinner, lighter cables. This makes them ideal for high-speed applications like top-of-rack connections (connecting switches to servers within the same rack); direct digital control (enabling flexible interconnectivity within racks and across rows); and breakout solutions (splitting high-speed connections into multiple lower-speed channels). The high-speed interconnect market – which includes active optical cables, active electrical cables, direct attach copper cables, and others – is expected to grow to $17.1B by 2028, up from $10.7B in 2021 according to a market forecast report from The Insight Partners. The Keystone Family The Keystone 5nm DSP family caters to 400G and 800G applications, featuring a groundbreaking 106.25Gbps host side electrical I/O, aligning with the line side interface rate. Available variants support single-mode optics (EML and SiPh), multimode optics and Active Electrical Cables (AECs), offering comprehensive solutions with companion TIAs. Host side interfaces cover ethernet rates of 25G, 50G, and 100G per lane over C2M, MR, and LR host channels. The line side interfaces, tailored for 100G/λ DR, FR, and LR applications, also support these rates. These devices boast extensive DSP functionality, encompassing line-side transmitter DPD, TX FIR, receiver FFE, and DFE. With exceptional performance and signal integrity, these DSPs occupy a compact footprint (12mm x 13mm), ideal for next-gen module form-factors like QSFP-DD800 and OSFP800. Additionally, they are available as Known Good Die (KGD) for denser applications, such as OSFP-XD. About MaxLinear, Inc. MaxLinear, Inc. is a leading provider of radio frequency (RF), analog, digital, and mixed-signal integrated circuits for access and connectivity, wired and wireless infrastructure, and industrial and multimarket applications. MaxLinear is headquartered in Carlsbad, California. MaxLinear, the MaxLinear logo, any other MaxLinear trademarks are all property of MaxLinear, Inc. or one of MaxLinear's subsidiaries in the U.S.A. and other countries. All rights reserved.

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