Manufacturing Technology

HS Inc. Transitions Business Focus to Manufacturing Automation

HS Inc. Transitions Business Focus to Manufacturing Automation

HS Inc., announced today its strategic intent to focus on its automation integration business. Established in 1969, HS Inc. expanded its capabilities to include automated assembly solutions in 2000 and will transition resources to expand its automated technology capacity and offerings.

HS Inc. offers comprehensive automation technology solutions, including automated and manual assembly, material handling, plastic processing, and robot and vision integration. From design through installation and support, the company collaborates with customers to create a tailored automation application that delivers results.

As part of this decision, HS Inc. will wind down its tool and die division and move production of its automation technology into this facility. The move will allow the company to pursue larger, more complex automation opportunities due to increased floor space, better workflow and enhanced in-house machining capabilities.

“It is an incredibly difficult decision to transition away from the part of the business on which the company was founded. However, we are committed to growing and investing in our automation solutions that help companies improve quality and productivity,” said Dale Hermiller, president, HS Inc.

HS Inc. has implemented a strategy to wind down existing projects to ensure all tool and die customer requirements are met.

“There is never a good time to make this type of drastic change, but the current state of the tooling industry provides us a window where we can complete our remaining jobs in a way that minimizes risk to our customers,” added Hermiller.

This transition is expected to be completed by year end and HS Inc. will continue to service its automation customers and pursue new business during the implementation.

About HS Inc.

HS Inc. was founded in 1969 in Grand Rapids, Michigan. What began as a garage shop and a vision, has grown into a multi-facility company and a leader in the mold-making industry. Together, Harold and Marcia Steele founded the company and today Marcia Steele remains the sole owner and CEO of the corporation.

The success of HS Inc. is due in a large part to active involvement and investment in new technology and commitment to the manufacturing of world-class tooling. HS Inc.'s commitment to new technology and manufacturing practices began in 1978 with a major investment in computerized design and machining capabilities. Being one of the first in the industry to utilize CAD/CAM technology, HS Inc. has since been at the forefront of development and deployment of design and programming software.

Spotlight

Other News
Manufacturing Technology

MaxLinear Launches Product Design Kit for Active Electrical Cables Using Keystone PAM4 DSP

MaxLinear | February 02, 2024

MaxLinear, Inc. a leading provider of high-speed interconnect ICs enabling data center, metro, and wireless transport networks, announced the availability of a comprehensive product design kit (PDK) to optimize performance and accelerate the time to market for high-speed Active Electrical Cables (AEC) using MaxLinear’s 5nm PAM4 DSP, Keystone. The PDK is a cost-cutting and time-saving tool for cable manufacturers who want to quickly integrate Keystone into their active electrical cables. MaxLinear’s Keystone PAM4 DSP offers a significant power advantage in AEC applications, which is increasingly becoming a critical factor for hyperscale data centers. The use of 5nm CMOS technology enables designers and manufacturers to build high-speed cables that meet the need for low power, highly integrated, high performance interconnect solutions that will drive the next generation of hyperscale cloud networks. Manufacturers taking advantage of MaxLinear’s PDK to optimize cable designs using Keystone PAM4 DSP will gain a distinct advantage over competitor solutions when trying to maximize reach and minimize power consumption. The PDK makes Keystone easy to integrate with strong applications support, multiple tools to optimize and monitor performance, and reference designs (SW and HW) to accelerate integration. Sophisticated software allows for quick design optimization for the lowest possible power consumption and maximizing cable reach. Cable designers can constantly monitor performance, route signals from any port to any port, and take advantage of hitless firmware upgrades. “MaxLinear is focused on providing not only industry-leading interconnect technologies but also a comprehensive suite of tools to support our manufacturing and design partners,” said Drew Guckenberger, Vice President of High Speed Interconnect at MaxLinear. “Our development kit for our Keystone products provides them with a path to take products to market more quickly and more cost-effectively.” Active electrical cables (AECs) are revolutionizing data center connections. Unlike passive cables, they actively boost signals, allowing for longer distances (up to 7 meters for 400G), higher bandwidth, and thinner, lighter cables. This makes them ideal for high-speed applications like top-of-rack connections (connecting switches to servers within the same rack); direct digital control (enabling flexible interconnectivity within racks and across rows); and breakout solutions (splitting high-speed connections into multiple lower-speed channels). The high-speed interconnect market – which includes active optical cables, active electrical cables, direct attach copper cables, and others – is expected to grow to $17.1B by 2028, up from $10.7B in 2021 according to a market forecast report from The Insight Partners. The Keystone Family The Keystone 5nm DSP family caters to 400G and 800G applications, featuring a groundbreaking 106.25Gbps host side electrical I/O, aligning with the line side interface rate. Available variants support single-mode optics (EML and SiPh), multimode optics and Active Electrical Cables (AECs), offering comprehensive solutions with companion TIAs. Host side interfaces cover ethernet rates of 25G, 50G, and 100G per lane over C2M, MR, and LR host channels. The line side interfaces, tailored for 100G/λ DR, FR, and LR applications, also support these rates. These devices boast extensive DSP functionality, encompassing line-side transmitter DPD, TX FIR, receiver FFE, and DFE. With exceptional performance and signal integrity, these DSPs occupy a compact footprint (12mm x 13mm), ideal for next-gen module form-factors like QSFP-DD800 and OSFP800. Additionally, they are available as Known Good Die (KGD) for denser applications, such as OSFP-XD. About MaxLinear, Inc. MaxLinear, Inc. is a leading provider of radio frequency (RF), analog, digital, and mixed-signal integrated circuits for access and connectivity, wired and wireless infrastructure, and industrial and multimarket applications. MaxLinear is headquartered in Carlsbad, California. MaxLinear, the MaxLinear logo, any other MaxLinear trademarks are all property of MaxLinear, Inc. or one of MaxLinear's subsidiaries in the U.S.A. and other countries. All rights reserved.

Read More