Manufacturing Technology

Desktop Metal Qualifies D2 Tool Steel for Additive Manufacturing With the Production System

Tool Steel for Additive Manufacturing
Desktop Metal today announced it has qualified the use of D2 tool steel for the Production System™ platform, which leverages patent pending Single Pass Jetting™ (SPJ) technology designed to achieve the fastest build speeds in the metal additive manufacturing industry. Businesses can now leverage SPJ technology for the production of parts in high-strength, high-temperature applications such as cold work metal forming tools, dies, and punches as well as injection molds with conformal cooling channels.

D2 tool steel is a versatile high-carbon, high-chromium air-hardening tool steel characterized by its high hardness and compressive strength after heat treatment. This tool steel also offers extremely high wear resistance properties, dimensional stability, and corrosion resistance in the hardened condition, a key benefit for conformal cooling applications. D2 is used for a wide variety of cold work tools that require a combination of wear resistance and moderate toughness, such as coining and sizing tool members, blanking and forming dies, shear cutting tools, gauges, burnishing tools, and other wear parts.

“Our materials science team is constantly working to develop new materials and processes to make 3D printing accessible to all industries and applications,We are responding to the demand from our customers across manufacturing and industrial industries for materials like D2 tool steel that enable the production of critical forming and cutting tools, and in various other applications where high hardness is valued.”

Jonah Myerberg, co-founder and CTO of Desktop Metal

Desktop Metal’s materials science team has qualified and fully characterized D2 tool steel printed on Production System technology in accordance with ASTM testing requirements.

Rotating Cam
Cams used in oil and gas or chemical processing applications convert rotary motion into reciprocating linear motion in a machine. Typically these parts require multiple manufacturing steps, beginning with CNC machining and followed by broaching of the spline on a separate machine. Binder jetting enables the production of cams in a single printing step, reducing both the cost and lead time of the part, while also supporting the production of numerous cam sizes in a single build to accommodate different machines, all without any fixturing or tooling required. D2 tool steel is critical for this application because of its hardness and corrosion resistance, which ensures a longer lifetime as the cam mechanically interacts with a sliding pin. In addition, because these components are often integrated into machines operating in harsh environments, the corrosion resistance provided by D2 ensures that the parts will perform as intended and not deteriorate.

The Production System - World’s Fastest Way to 3D Print Metal Parts At-Scale

Created by the inventors of binder jetting and single-pass inkjet technology, the Production System is an industrial manufacturing platform powered by Desktop Metal’s SPJ technology. It is designed to achieve speeds up to 100 times those of legacy powder bed fusion additive manufacturing technologies and enable production quantities of up to millions of parts per year at costs competitive with conventional mass production techniques.

The Production System platform consists of two printer models: the P-1, a solution for process development and serial production applications, and the P-50, a large form factor mass production solution for end-use parts. The Production System combines Desktop Metal engineered binders with an open material platform, allowing customers to produce high-performance parts using the same low-cost metal powders used in the Metal Injection Molding (MIM) industry. An inert processing environment enables compatibility with a variety of materials, including high-performance alloys and even reactive metal powders, such as aluminum and titanium.

In addition to D2, the materials library for the Production System platform has expanded to include 420 stainless steel, nickel alloy IN625, 4140 low-alloy steel, 316L stainless steel, and 17-4PH stainless steel, each of which have been qualified by Desktop Metal. The platform also supports several customer-qualified materials, including silver and gold, and Desktop Metal plans to add additional metals to its portfolio, including tool steels, stainless steels, superalloys, copper, and more.

About Desktop Metal
Desktop Metal, Inc., based in Burlington, Massachusetts, is accelerating the transformation of manufacturing with an expansive portfolio of 3D printing solutions, from rapid prototyping to mass production. Founded in 2015 by leaders in advanced manufacturing, metallurgy, and robotics, the company is addressing the unmet challenges of speed, cost, and quality to make additive manufacturing an essential tool for engineers and manufacturers around the world. Desktop Metal was selected as one of the world’s 30 most promising Technology Pioneers by the World Economic Forum, named to MIT Technology Review’s list of 50 Smartest Companies, and the 2021 winner of Fast Company’s Innovation by Design Award in materials.

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PsiQuantum | January 30, 2024

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By pioneering PsiQuantum’s Qlimate solutions with industry leader Mitsubishi Chemical, MUFG is at the forefront of quantum computing for sustainability. This joint project will determine whether high-accuracy estimates of excited state properties are feasible on early-generation fault-tolerant quantum computers, specifically focusing on diarylethenes used for energy-efficient photoswitching applications. The project will allow Mitsubishi Chemical to gain early insights into how and when fault-tolerant quantum computing can be deployed in support of critical, scalable, sustainable materials. Because predicting the optical properties of materials requires complex analysis of excited states, standard algorithmic techniques for simulating these molecules (such as the Density Functional Theory, or DFT) often produce qualitatively incorrect results. 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We are grateful for MUFG’s visionary support in our mission to deploy high-impact quantum computing solutions to fight climate change.” Suguru Azegami, Managing Director, Sustainable Business Division, MUFG said: “We are excited to partner with PsiQuantum and Mitsubishi Chemical on our journey to explore possibilities of quantum computing technologies to solve the imminent global challenge. PsiQuantum’s vision to develop the first utility scale quantum computer before the end of the decade has inspired us, which led our initiative to participate in the Qlimate partnership as the first and sole member from Japan. Mitsubishi Chemical is leading efforts to use the cutting-edge technology to develop next generation materials and we are honored to support the company as its long term financial partner.” Qi Gao, Senior Chief Scientist, Mitsubishi Chemical said: “We are pleased to be part of the partnership and are grateful for MUFG’s support. Mitsubishi Chemical’s over 40 years background in computational chemistry and PsiQuantum’s domain specific knowledge for quantum control is a great fit with the collaboration effort of improving calculation accuracy on quantum device. We hope the partnership will accelerate the innovation of revolutionizing computational studies in chemistry and materials science.” About PsiQuantum PsiQuantum is a private company, founded in 2015 and headquartered in Palo Alto, California. The company’s only mission is to build and deploy the world’s first useful, large-scale quantum computer. Many teams around the world today have demonstrated prototype quantum computing systems, but it is widely accepted that much larger systems are necessary in order to unlock transformational applications across drug discovery, climate technologies, finance, transportation, security & defense and beyond. PsiQuantum’s photonic approach enables rapid scaling via direct leverage of high-volume semiconductor manufacturing and cryogenic infrastructure. The company is partnered with the SLAC National Accelerator Laboratory at Stanford University and Sci-Tech Daresbury in the United Kingdom. About Mitsubishi UFJ Financial Group, Inc. (MUFG) Mitsubishi UFJ Financial Group, Inc. (MUFG) is one of the world’s leading financial groups. Headquartered in Tokyo and with over 360 years of history, MUFG has a global network with approximately 2,000 locations in more than 50 countries. The Group has about 160,000 employees and offers services including commercial banking, trust banking, securities, credit cards, consumer finance, asset management, and leasing. 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MaxLinear Launches Product Design Kit for Active Electrical Cables Using Keystone PAM4 DSP

MaxLinear | February 02, 2024

MaxLinear, Inc. a leading provider of high-speed interconnect ICs enabling data center, metro, and wireless transport networks, announced the availability of a comprehensive product design kit (PDK) to optimize performance and accelerate the time to market for high-speed Active Electrical Cables (AEC) using MaxLinear’s 5nm PAM4 DSP, Keystone. The PDK is a cost-cutting and time-saving tool for cable manufacturers who want to quickly integrate Keystone into their active electrical cables. MaxLinear’s Keystone PAM4 DSP offers a significant power advantage in AEC applications, which is increasingly becoming a critical factor for hyperscale data centers. The use of 5nm CMOS technology enables designers and manufacturers to build high-speed cables that meet the need for low power, highly integrated, high performance interconnect solutions that will drive the next generation of hyperscale cloud networks. Manufacturers taking advantage of MaxLinear’s PDK to optimize cable designs using Keystone PAM4 DSP will gain a distinct advantage over competitor solutions when trying to maximize reach and minimize power consumption. The PDK makes Keystone easy to integrate with strong applications support, multiple tools to optimize and monitor performance, and reference designs (SW and HW) to accelerate integration. Sophisticated software allows for quick design optimization for the lowest possible power consumption and maximizing cable reach. Cable designers can constantly monitor performance, route signals from any port to any port, and take advantage of hitless firmware upgrades. “MaxLinear is focused on providing not only industry-leading interconnect technologies but also a comprehensive suite of tools to support our manufacturing and design partners,” said Drew Guckenberger, Vice President of High Speed Interconnect at MaxLinear. “Our development kit for our Keystone products provides them with a path to take products to market more quickly and more cost-effectively.” Active electrical cables (AECs) are revolutionizing data center connections. Unlike passive cables, they actively boost signals, allowing for longer distances (up to 7 meters for 400G), higher bandwidth, and thinner, lighter cables. This makes them ideal for high-speed applications like top-of-rack connections (connecting switches to servers within the same rack); direct digital control (enabling flexible interconnectivity within racks and across rows); and breakout solutions (splitting high-speed connections into multiple lower-speed channels). The high-speed interconnect market – which includes active optical cables, active electrical cables, direct attach copper cables, and others – is expected to grow to $17.1B by 2028, up from $10.7B in 2021 according to a market forecast report from The Insight Partners. The Keystone Family The Keystone 5nm DSP family caters to 400G and 800G applications, featuring a groundbreaking 106.25Gbps host side electrical I/O, aligning with the line side interface rate. Available variants support single-mode optics (EML and SiPh), multimode optics and Active Electrical Cables (AECs), offering comprehensive solutions with companion TIAs. Host side interfaces cover ethernet rates of 25G, 50G, and 100G per lane over C2M, MR, and LR host channels. The line side interfaces, tailored for 100G/λ DR, FR, and LR applications, also support these rates. These devices boast extensive DSP functionality, encompassing line-side transmitter DPD, TX FIR, receiver FFE, and DFE. With exceptional performance and signal integrity, these DSPs occupy a compact footprint (12mm x 13mm), ideal for next-gen module form-factors like QSFP-DD800 and OSFP800. Additionally, they are available as Known Good Die (KGD) for denser applications, such as OSFP-XD. About MaxLinear, Inc. MaxLinear, Inc. is a leading provider of radio frequency (RF), analog, digital, and mixed-signal integrated circuits for access and connectivity, wired and wireless infrastructure, and industrial and multimarket applications. MaxLinear is headquartered in Carlsbad, California. MaxLinear, the MaxLinear logo, any other MaxLinear trademarks are all property of MaxLinear, Inc. or one of MaxLinear's subsidiaries in the U.S.A. and other countries. All rights reserved.

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