Robotics and Automation

Continental and Google Cloud Partner to Drive Automotive Advancements

Continental and Google Cloud Partner to Drive Automotive Advancements
  • Google Cloud and Continental collaborate to transform the automotive industry with cutting-edge AI-driven solutions.
  • Integration of Conversational AI redefines in-car voice assistants for enhanced user experiences.
  • The partnership promises accelerated innovation and cost reductions for Automotive OEMs as well as a safer, more efficient, and highly connected future.

Google Cloud and Continental have joined forces to revolutionize the automotive industry. By merging Continental's automotive expertise with Google's data and AI capabilities, the two companies aim to create cutting-edge, user-centric automotive solutions. Their initial focus is redefining automotive voice assistants by integrating Google Cloud's Conversational AI into Continental's Smart Cockpit High-Performance Computer (HPC) with Android Automotive OS.

Philipp von Hirschheydt, Head of the Automotive Group Sector and Executive Board Member of Continental, said,

"By working with Google Cloud, we can accelerate our innovation and enhance our solutions for the software-defined vehicle. This collaboration will help our customers to reduce costs, improve efficiency, flexibility, and increase value for all."

[Source – Cision PR Newswire]

The solutions were showcased at IAA MOBILITY 2023 in Munich, introducing innovative ways for passengers to communicate with their vehicles using natural language powered by generative AI. Continental's Smart Cockpit HPC ensures efficient system performance and reduced costs for automakers, paving the way for enhanced in-car connectivity and user experiences.

Behshad Behzadi, VP of Engineering at Google Cloud GenAI, expressed enthusiasm for the partnership with Continental, highlighting its significant potential. He also mentioned that the collaboration with Continental would enable the integration of Conversational AI technologies into vehicles, streamlining the process for automotive companies to harness Generative AI and develop innovative passenger experiences in cars.

This partnership promises accelerated innovation, paving the way for safer, more efficient, and highly connected automotive solutions. Automotive Original Equipment Manufacturers (OEMs) stand to gain significant cost reductions through streamlined processes, reduced complexity, and shorter development timelines, ultimately expediting the introduction of cutting-edge products. Furthermore, this collaboration is poised to enhance the overall user experience, benefiting drivers and passengers as they embrace the future of automotive technology and connectivity.

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MaxLinear Launches Product Design Kit for Active Electrical Cables Using Keystone PAM4 DSP

MaxLinear | February 02, 2024

MaxLinear, Inc. a leading provider of high-speed interconnect ICs enabling data center, metro, and wireless transport networks, announced the availability of a comprehensive product design kit (PDK) to optimize performance and accelerate the time to market for high-speed Active Electrical Cables (AEC) using MaxLinear’s 5nm PAM4 DSP, Keystone. The PDK is a cost-cutting and time-saving tool for cable manufacturers who want to quickly integrate Keystone into their active electrical cables. MaxLinear’s Keystone PAM4 DSP offers a significant power advantage in AEC applications, which is increasingly becoming a critical factor for hyperscale data centers. The use of 5nm CMOS technology enables designers and manufacturers to build high-speed cables that meet the need for low power, highly integrated, high performance interconnect solutions that will drive the next generation of hyperscale cloud networks. Manufacturers taking advantage of MaxLinear’s PDK to optimize cable designs using Keystone PAM4 DSP will gain a distinct advantage over competitor solutions when trying to maximize reach and minimize power consumption. The PDK makes Keystone easy to integrate with strong applications support, multiple tools to optimize and monitor performance, and reference designs (SW and HW) to accelerate integration. Sophisticated software allows for quick design optimization for the lowest possible power consumption and maximizing cable reach. Cable designers can constantly monitor performance, route signals from any port to any port, and take advantage of hitless firmware upgrades. “MaxLinear is focused on providing not only industry-leading interconnect technologies but also a comprehensive suite of tools to support our manufacturing and design partners,” said Drew Guckenberger, Vice President of High Speed Interconnect at MaxLinear. “Our development kit for our Keystone products provides them with a path to take products to market more quickly and more cost-effectively.” Active electrical cables (AECs) are revolutionizing data center connections. Unlike passive cables, they actively boost signals, allowing for longer distances (up to 7 meters for 400G), higher bandwidth, and thinner, lighter cables. This makes them ideal for high-speed applications like top-of-rack connections (connecting switches to servers within the same rack); direct digital control (enabling flexible interconnectivity within racks and across rows); and breakout solutions (splitting high-speed connections into multiple lower-speed channels). The high-speed interconnect market – which includes active optical cables, active electrical cables, direct attach copper cables, and others – is expected to grow to $17.1B by 2028, up from $10.7B in 2021 according to a market forecast report from The Insight Partners. The Keystone Family The Keystone 5nm DSP family caters to 400G and 800G applications, featuring a groundbreaking 106.25Gbps host side electrical I/O, aligning with the line side interface rate. Available variants support single-mode optics (EML and SiPh), multimode optics and Active Electrical Cables (AECs), offering comprehensive solutions with companion TIAs. Host side interfaces cover ethernet rates of 25G, 50G, and 100G per lane over C2M, MR, and LR host channels. The line side interfaces, tailored for 100G/λ DR, FR, and LR applications, also support these rates. These devices boast extensive DSP functionality, encompassing line-side transmitter DPD, TX FIR, receiver FFE, and DFE. With exceptional performance and signal integrity, these DSPs occupy a compact footprint (12mm x 13mm), ideal for next-gen module form-factors like QSFP-DD800 and OSFP800. Additionally, they are available as Known Good Die (KGD) for denser applications, such as OSFP-XD. About MaxLinear, Inc. MaxLinear, Inc. is a leading provider of radio frequency (RF), analog, digital, and mixed-signal integrated circuits for access and connectivity, wired and wireless infrastructure, and industrial and multimarket applications. MaxLinear is headquartered in Carlsbad, California. MaxLinear, the MaxLinear logo, any other MaxLinear trademarks are all property of MaxLinear, Inc. or one of MaxLinear's subsidiaries in the U.S.A. and other countries. All rights reserved.

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