Future Of Manufacturing

Coherent Introduces New Laser Welding Head With Tactile Seam-Tracking Technology for Electric Vehicle Manufacturing

Coherent Introduces New Laser Welding Head With Tactile Seam-Tracking Technology for Electric Vehicle Manufacturing

Coherent Corp., a leader in advanced laser processing solutions, today introduced HIGHtactile, a new laser welding head with tactile seam-tracking technology ideal for electric vehicle (EV) manufacturing applications.

The growing demand for EVs is expanding applications for lasers in automotive manufacturing, spurring innovations in process automation and improvements in laser usability. Coherent introduced HIGHtactile, a laser processing head with a new patent-pending seam-tracking technology that is easily configurable to perform highly automated fillet welding and brazing.

“HIGHtactile is the culmination of twenty years of experience designing seam-tracking systems for welding and brazing, making it a truly unique product on the market,” said Dr. Karlheinz Gulden, Senior Vice President, Laser Components and Subsystems Business Unit. “Our laser processing heads have had great success in automotive manufacturing applications. Now, with the rapidly growing demand for electric vehicles, we are addressing a broad range of new opportunities in critical applications, such as fillet welds that enable battery trays to be stronger and stiffer while at the same time reducing weight.”

HIGHtactile is extremely user-friendly, thanks to its wide range of embedded sensors that streamline almost every functional aspect of the welding head. The sensors improve process learning and enable faster laser processing. HIGHtactile can be configured to maximize performance for specific applications such as brazing steel or welding aluminum and steel. Those processes are typically found in body-in-white applications such as trunk lid and roof top brazing. HIGHtactile can be used with a wide range of lasers, wire feeders, and process monitoring systems.

Coherent will exhibit at Laser World of Photonics, in Munich, Germany, June 27-30, stand B3.321; Laser Korea, in Seoul, July 5-7, stand 4101; and Laser World of Photonics China, in Shanghai, stand W2 2140, July 11-13. At these conferences, Coherent will showcase the most recent additions to its broad portfolio of differentiated solutions for materials processing.

About Coherent

Coherent empowers market innovators to define the future through breakthrough technologies, from materials to systems. We deliver innovations that resonate with our customers in diversified applications for the industrial, communications, electronics, and instrumentation markets. Headquartered in Saxonburg, Pennsylvania, Coherent has research and development, manufacturing, sales, service, and distribution facilities worldwide.

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MaxLinear Launches Product Design Kit for Active Electrical Cables Using Keystone PAM4 DSP

MaxLinear | February 02, 2024

MaxLinear, Inc. a leading provider of high-speed interconnect ICs enabling data center, metro, and wireless transport networks, announced the availability of a comprehensive product design kit (PDK) to optimize performance and accelerate the time to market for high-speed Active Electrical Cables (AEC) using MaxLinear’s 5nm PAM4 DSP, Keystone. The PDK is a cost-cutting and time-saving tool for cable manufacturers who want to quickly integrate Keystone into their active electrical cables. MaxLinear’s Keystone PAM4 DSP offers a significant power advantage in AEC applications, which is increasingly becoming a critical factor for hyperscale data centers. The use of 5nm CMOS technology enables designers and manufacturers to build high-speed cables that meet the need for low power, highly integrated, high performance interconnect solutions that will drive the next generation of hyperscale cloud networks. Manufacturers taking advantage of MaxLinear’s PDK to optimize cable designs using Keystone PAM4 DSP will gain a distinct advantage over competitor solutions when trying to maximize reach and minimize power consumption. The PDK makes Keystone easy to integrate with strong applications support, multiple tools to optimize and monitor performance, and reference designs (SW and HW) to accelerate integration. Sophisticated software allows for quick design optimization for the lowest possible power consumption and maximizing cable reach. Cable designers can constantly monitor performance, route signals from any port to any port, and take advantage of hitless firmware upgrades. “MaxLinear is focused on providing not only industry-leading interconnect technologies but also a comprehensive suite of tools to support our manufacturing and design partners,” said Drew Guckenberger, Vice President of High Speed Interconnect at MaxLinear. “Our development kit for our Keystone products provides them with a path to take products to market more quickly and more cost-effectively.” Active electrical cables (AECs) are revolutionizing data center connections. Unlike passive cables, they actively boost signals, allowing for longer distances (up to 7 meters for 400G), higher bandwidth, and thinner, lighter cables. This makes them ideal for high-speed applications like top-of-rack connections (connecting switches to servers within the same rack); direct digital control (enabling flexible interconnectivity within racks and across rows); and breakout solutions (splitting high-speed connections into multiple lower-speed channels). The high-speed interconnect market – which includes active optical cables, active electrical cables, direct attach copper cables, and others – is expected to grow to $17.1B by 2028, up from $10.7B in 2021 according to a market forecast report from The Insight Partners. The Keystone Family The Keystone 5nm DSP family caters to 400G and 800G applications, featuring a groundbreaking 106.25Gbps host side electrical I/O, aligning with the line side interface rate. Available variants support single-mode optics (EML and SiPh), multimode optics and Active Electrical Cables (AECs), offering comprehensive solutions with companion TIAs. Host side interfaces cover ethernet rates of 25G, 50G, and 100G per lane over C2M, MR, and LR host channels. The line side interfaces, tailored for 100G/λ DR, FR, and LR applications, also support these rates. These devices boast extensive DSP functionality, encompassing line-side transmitter DPD, TX FIR, receiver FFE, and DFE. With exceptional performance and signal integrity, these DSPs occupy a compact footprint (12mm x 13mm), ideal for next-gen module form-factors like QSFP-DD800 and OSFP800. Additionally, they are available as Known Good Die (KGD) for denser applications, such as OSFP-XD. About MaxLinear, Inc. MaxLinear, Inc. is a leading provider of radio frequency (RF), analog, digital, and mixed-signal integrated circuits for access and connectivity, wired and wireless infrastructure, and industrial and multimarket applications. MaxLinear is headquartered in Carlsbad, California. MaxLinear, the MaxLinear logo, any other MaxLinear trademarks are all property of MaxLinear, Inc. or one of MaxLinear's subsidiaries in the U.S.A. and other countries. All rights reserved.

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