Manufacturing Technology

CAPTURE 3D Makes Digital Engineering Affordable with GOM Scan 1

CAPTURE 3D, the leading provider of innovative 3D measurement solutions and the official U.S. partner for GOM GmbH, a ZEISS company, today announced GOM Scan 1— an affordable, precise blue light 3D scanner with mesh editing capabilities to accurately digitize physical objects into the 3D world. Offered at an affordable price, GOM Scan 1 provides accessibility to the leading GOM blue light 3D scanning technology used by top manufacturers worldwide.

This solution reduces the barrier to entry into digital engineering with its price point that allows more people to experience the power and benefits of 3D digitalization. Ideal for serious hobbyists or industrial engineers, GOM Scan 1 digitizes small to medium-sized objects in high-quality data.

"GOM Scan 1 is a great tool to support great ideas, and with technology that's proven to meet professional and industrial standards, you can rely on this 3D scanner to help you get things done," said CAPTURE 3D General Manager Richard White.

GOM Scan 1 is used for diverse applications such as creating a digital file of an object for 3D printing, reverse engineering, manufacturing, quality control, virtual display and 3D modeling, research and education, art and design, and healthcare. GOM Scan 1 offers GOM Inspect 3D inspection software to quickly capture, visualize and analyze 3D measurement data within the same workflow.

Intelligent Mesh Editing for 3D Printing
GOM Inspect delivers a comprehensive 3D measurement experience that provides practical advantages for modern digital engineering applications. For example, mesh editing software functions allow users to smooth, thin and refine polygon meshes, fill holes and extract curvature lines, resulting in accurate meshes that support the reproduction of parts, creation of 3D models, development of new products, and 3D printing and reverse engineering applications. The smart polygonization software feature creates a highly detailed mesh while keeping its size easy to handle by importing and aligning CAD and mesh files to create surface comparisons and dimensional inspections and generate reports. These meshes can be saved in many standard formats, including STL, G3D, and POL.

Fast Fringe Projection and Blue Light Technology
GOM Scan 1 joins CAPTURE 3D's collection of non-contact blue light 3D scanners that utilize GOM's proprietary fringe projection technology to capture detailed full-field data with narrowband blue light recorded by two cameras that work based on GOM's stereo camera principle. The powerful light source enables short measuring times and filters out interfering ambient light during data acquisition. This principle allows the sensor to recognize and compensate for changing ambient conditions. At the same time, its software continuously monitors the calibration status, transformation accuracy, environmental changes, and part movements to ensure high-quality measurement data collection.

Small and Lightweight for Easy Travel
Weighing 2.5 kg, GOM Scan 1 is compact and lightweight. The travel case it offers fits everything required for scanning, making it possible to transport the system wherever small and medium-sized parts need to be measured. Accessory options include a desk stand to mount the scanner and an automated rotation table. GOM Scan 1 caters to various applications with three measuring volumes: 100, 200, and 400 mm field of view.

About CAPTURE 3D
CAPTURE 3D, a ZEISS company, is the leading provider of innovative 3D measurement solutions in the United States, helping companies solve engineering challenges, save time, minimize costs, and improve their overall time to market strategy. As the official U.S. distributor for GOM GmbH/ZEISS USA, CAPTURE 3D combines vast industry expertise with robust technology to change the way people think about and experience measurement.

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Teledyne Relays Unveils Innovative Multi-Function Timer Series

Teledyne Relays, Inc. | January 29, 2024

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Smart Factory

PsiQuantum, Mitsubishi UFJ Financial Group and Mitsubishi Chemical Announce Partnership to Design Energy-Efficient Materials on PsiQuantum’s

PsiQuantum | January 30, 2024

PsiQuantum and Mitsubishi UFJ Financial Group announced that they are beginning work with Mitsubishi Chemical Group on a joint project to simulate excited states of photochromic molecules which have widespread industrial and residential potential applications such as the development of smart windows, energy-efficient data storage, solar energy storage and solar cells, and other photoswitching use cases. Qlimate, a PsiQuantum-led initiative that includes MUFG as a partner, focuses on using fault-tolerant quantum computing to crack the most challenging computational problems and accelerate the development of scalable breakthroughs across climate technologies, including more energy-efficient materials. Mitsubishi UFJ Financial Group (MUFG) is committed to supporting the world’s transition to a sustainable future, and to encourage industry access to the most promising breakthrough technologies. By pioneering PsiQuantum’s Qlimate solutions with industry leader Mitsubishi Chemical, MUFG is at the forefront of quantum computing for sustainability. This joint project will determine whether high-accuracy estimates of excited state properties are feasible on early-generation fault-tolerant quantum computers, specifically focusing on diarylethenes used for energy-efficient photoswitching applications. The project will allow Mitsubishi Chemical to gain early insights into how and when fault-tolerant quantum computing can be deployed in support of critical, scalable, sustainable materials. Because predicting the optical properties of materials requires complex analysis of excited states, standard algorithmic techniques for simulating these molecules (such as the Density Functional Theory, or DFT) often produce qualitatively incorrect results. 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We are grateful for MUFG’s visionary support in our mission to deploy high-impact quantum computing solutions to fight climate change.” Suguru Azegami, Managing Director, Sustainable Business Division, MUFG said: “We are excited to partner with PsiQuantum and Mitsubishi Chemical on our journey to explore possibilities of quantum computing technologies to solve the imminent global challenge. PsiQuantum’s vision to develop the first utility scale quantum computer before the end of the decade has inspired us, which led our initiative to participate in the Qlimate partnership as the first and sole member from Japan. Mitsubishi Chemical is leading efforts to use the cutting-edge technology to develop next generation materials and we are honored to support the company as its long term financial partner.” Qi Gao, Senior Chief Scientist, Mitsubishi Chemical said: “We are pleased to be part of the partnership and are grateful for MUFG’s support. Mitsubishi Chemical’s over 40 years background in computational chemistry and PsiQuantum’s domain specific knowledge for quantum control is a great fit with the collaboration effort of improving calculation accuracy on quantum device. We hope the partnership will accelerate the innovation of revolutionizing computational studies in chemistry and materials science.” About PsiQuantum PsiQuantum is a private company, founded in 2015 and headquartered in Palo Alto, California. The company’s only mission is to build and deploy the world’s first useful, large-scale quantum computer. Many teams around the world today have demonstrated prototype quantum computing systems, but it is widely accepted that much larger systems are necessary in order to unlock transformational applications across drug discovery, climate technologies, finance, transportation, security & defense and beyond. PsiQuantum’s photonic approach enables rapid scaling via direct leverage of high-volume semiconductor manufacturing and cryogenic infrastructure. The company is partnered with the SLAC National Accelerator Laboratory at Stanford University and Sci-Tech Daresbury in the United Kingdom. About Mitsubishi UFJ Financial Group, Inc. (MUFG) Mitsubishi UFJ Financial Group, Inc. (MUFG) is one of the world’s leading financial groups. Headquartered in Tokyo and with over 360 years of history, MUFG has a global network with approximately 2,000 locations in more than 50 countries. The Group has about 160,000 employees and offers services including commercial banking, trust banking, securities, credit cards, consumer finance, asset management, and leasing. 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Manufacturing Technology

MaxLinear Launches Product Design Kit for Active Electrical Cables Using Keystone PAM4 DSP

MaxLinear | February 02, 2024

MaxLinear, Inc. a leading provider of high-speed interconnect ICs enabling data center, metro, and wireless transport networks, announced the availability of a comprehensive product design kit (PDK) to optimize performance and accelerate the time to market for high-speed Active Electrical Cables (AEC) using MaxLinear’s 5nm PAM4 DSP, Keystone. The PDK is a cost-cutting and time-saving tool for cable manufacturers who want to quickly integrate Keystone into their active electrical cables. MaxLinear’s Keystone PAM4 DSP offers a significant power advantage in AEC applications, which is increasingly becoming a critical factor for hyperscale data centers. The use of 5nm CMOS technology enables designers and manufacturers to build high-speed cables that meet the need for low power, highly integrated, high performance interconnect solutions that will drive the next generation of hyperscale cloud networks. Manufacturers taking advantage of MaxLinear’s PDK to optimize cable designs using Keystone PAM4 DSP will gain a distinct advantage over competitor solutions when trying to maximize reach and minimize power consumption. The PDK makes Keystone easy to integrate with strong applications support, multiple tools to optimize and monitor performance, and reference designs (SW and HW) to accelerate integration. Sophisticated software allows for quick design optimization for the lowest possible power consumption and maximizing cable reach. Cable designers can constantly monitor performance, route signals from any port to any port, and take advantage of hitless firmware upgrades. “MaxLinear is focused on providing not only industry-leading interconnect technologies but also a comprehensive suite of tools to support our manufacturing and design partners,” said Drew Guckenberger, Vice President of High Speed Interconnect at MaxLinear. “Our development kit for our Keystone products provides them with a path to take products to market more quickly and more cost-effectively.” Active electrical cables (AECs) are revolutionizing data center connections. Unlike passive cables, they actively boost signals, allowing for longer distances (up to 7 meters for 400G), higher bandwidth, and thinner, lighter cables. This makes them ideal for high-speed applications like top-of-rack connections (connecting switches to servers within the same rack); direct digital control (enabling flexible interconnectivity within racks and across rows); and breakout solutions (splitting high-speed connections into multiple lower-speed channels). The high-speed interconnect market – which includes active optical cables, active electrical cables, direct attach copper cables, and others – is expected to grow to $17.1B by 2028, up from $10.7B in 2021 according to a market forecast report from The Insight Partners. The Keystone Family The Keystone 5nm DSP family caters to 400G and 800G applications, featuring a groundbreaking 106.25Gbps host side electrical I/O, aligning with the line side interface rate. Available variants support single-mode optics (EML and SiPh), multimode optics and Active Electrical Cables (AECs), offering comprehensive solutions with companion TIAs. Host side interfaces cover ethernet rates of 25G, 50G, and 100G per lane over C2M, MR, and LR host channels. The line side interfaces, tailored for 100G/λ DR, FR, and LR applications, also support these rates. These devices boast extensive DSP functionality, encompassing line-side transmitter DPD, TX FIR, receiver FFE, and DFE. With exceptional performance and signal integrity, these DSPs occupy a compact footprint (12mm x 13mm), ideal for next-gen module form-factors like QSFP-DD800 and OSFP800. Additionally, they are available as Known Good Die (KGD) for denser applications, such as OSFP-XD. About MaxLinear, Inc. MaxLinear, Inc. is a leading provider of radio frequency (RF), analog, digital, and mixed-signal integrated circuits for access and connectivity, wired and wireless infrastructure, and industrial and multimarket applications. MaxLinear is headquartered in Carlsbad, California. MaxLinear, the MaxLinear logo, any other MaxLinear trademarks are all property of MaxLinear, Inc. or one of MaxLinear's subsidiaries in the U.S.A. and other countries. All rights reserved.

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