Manufacturing Technology

Altium Packaging’s Allentown Manufacturing Facility Achieves ISCC Certification

Altium Packaging’s Allentown Manufacturing Facility Achieves ISCC Certification

On February 13, 2023, Altium Packaging, a leading plastic packaging manufacturer, announced that its Allentown, PA, facility has received ISCC (International Sustainability and Carbon Certification) PLUS certification.

The ISCC PLUS certification enables Altium to replace a portion or all of the virgin resin with a certified circular polymer in order to manufacture products with the same material performance as virgin. Altium will be able to offer in-demand certified circular products to market and give clients circular material alternatives on a mass balance basis to satisfy their sustainability goals with this certification.

ISCC certification is a worldwide recognized standard for the sustainable production of biomaterials, biofuels, and other products. It ensures that the raw materials used in producing these products are sourced sustainably and that the manufacturing process adheres to stringent environmental and social standards.

Altium's Chief Marketing and Innovation Officer Brian Hankin commented, "This certification demonstrates our ongoing dedication to reducing our environmental impact and promoting sustainable practices throughout our supply chain." He added, "We are committed to continuing our efforts to reduce our carbon footprint and promote sustainable production in the future, and we look forward to working with our partners to do so. We will also work to certify additional sites as circular material supply and demand increases."

(Source – PR Web)

About Altium Packaging

Headquartered in Atlanta, Georgia, Altium Packaging is a leading customer-centric packaging solutions provider that assists businesses in growing and elevating their brand to the next level. It is supported by a network of facilities across Canada and the United States, as well as 100 years of quality and service. The company's cutting-edge design center, customized products, commitment to innovation, proprietary processes and a team of over 3,000 associates are dedicated to anticipating and fulfilling market and customer demands.

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MaxLinear Launches Product Design Kit for Active Electrical Cables Using Keystone PAM4 DSP

MaxLinear | February 02, 2024

MaxLinear, Inc. a leading provider of high-speed interconnect ICs enabling data center, metro, and wireless transport networks, announced the availability of a comprehensive product design kit (PDK) to optimize performance and accelerate the time to market for high-speed Active Electrical Cables (AEC) using MaxLinear’s 5nm PAM4 DSP, Keystone. The PDK is a cost-cutting and time-saving tool for cable manufacturers who want to quickly integrate Keystone into their active electrical cables. MaxLinear’s Keystone PAM4 DSP offers a significant power advantage in AEC applications, which is increasingly becoming a critical factor for hyperscale data centers. The use of 5nm CMOS technology enables designers and manufacturers to build high-speed cables that meet the need for low power, highly integrated, high performance interconnect solutions that will drive the next generation of hyperscale cloud networks. Manufacturers taking advantage of MaxLinear’s PDK to optimize cable designs using Keystone PAM4 DSP will gain a distinct advantage over competitor solutions when trying to maximize reach and minimize power consumption. The PDK makes Keystone easy to integrate with strong applications support, multiple tools to optimize and monitor performance, and reference designs (SW and HW) to accelerate integration. Sophisticated software allows for quick design optimization for the lowest possible power consumption and maximizing cable reach. Cable designers can constantly monitor performance, route signals from any port to any port, and take advantage of hitless firmware upgrades. “MaxLinear is focused on providing not only industry-leading interconnect technologies but also a comprehensive suite of tools to support our manufacturing and design partners,” said Drew Guckenberger, Vice President of High Speed Interconnect at MaxLinear. “Our development kit for our Keystone products provides them with a path to take products to market more quickly and more cost-effectively.” Active electrical cables (AECs) are revolutionizing data center connections. Unlike passive cables, they actively boost signals, allowing for longer distances (up to 7 meters for 400G), higher bandwidth, and thinner, lighter cables. This makes them ideal for high-speed applications like top-of-rack connections (connecting switches to servers within the same rack); direct digital control (enabling flexible interconnectivity within racks and across rows); and breakout solutions (splitting high-speed connections into multiple lower-speed channels). The high-speed interconnect market – which includes active optical cables, active electrical cables, direct attach copper cables, and others – is expected to grow to $17.1B by 2028, up from $10.7B in 2021 according to a market forecast report from The Insight Partners. The Keystone Family The Keystone 5nm DSP family caters to 400G and 800G applications, featuring a groundbreaking 106.25Gbps host side electrical I/O, aligning with the line side interface rate. Available variants support single-mode optics (EML and SiPh), multimode optics and Active Electrical Cables (AECs), offering comprehensive solutions with companion TIAs. Host side interfaces cover ethernet rates of 25G, 50G, and 100G per lane over C2M, MR, and LR host channels. The line side interfaces, tailored for 100G/λ DR, FR, and LR applications, also support these rates. These devices boast extensive DSP functionality, encompassing line-side transmitter DPD, TX FIR, receiver FFE, and DFE. With exceptional performance and signal integrity, these DSPs occupy a compact footprint (12mm x 13mm), ideal for next-gen module form-factors like QSFP-DD800 and OSFP800. Additionally, they are available as Known Good Die (KGD) for denser applications, such as OSFP-XD. About MaxLinear, Inc. MaxLinear, Inc. is a leading provider of radio frequency (RF), analog, digital, and mixed-signal integrated circuits for access and connectivity, wired and wireless infrastructure, and industrial and multimarket applications. MaxLinear is headquartered in Carlsbad, California. MaxLinear, the MaxLinear logo, any other MaxLinear trademarks are all property of MaxLinear, Inc. or one of MaxLinear's subsidiaries in the U.S.A. and other countries. All rights reserved.

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