3D Printing

3D Systems Insources Two Production Printer, Simplifies Production

3D Systems Insources Two Production Printer, Simplifies Production

3D Systems has completed its strategic initiative to insource the manufacturing of two key printer platforms, metal and polymer production printers, transferring this activity from two electronics manufacturing services (EMS) partners. This move empowers 3D Systems to control the entire manufacturing process, from design to production, with the aim of delivering high-quality, innovative products to its customers.

The insourcing activities occurred in France, Riom, and Rock Hill, South Carolina. The company now controls the entire manufacturing process, from design to production, to provide customers with innovative, high-quality products. In addition, with this enhanced manufacturing process control, 3D Systems has matched or enhanced production quality and decreased lead times to meet customer demand.

By bringing manufacturing in-house, 3D Systems can now offer products of superior quality and innovation to its customers. This strategic shift enables 3D Systems to strengthen quality control, reduce manufacturing cycle times, and expedite the introduction of new products to enhance customer satisfaction by shortening lead times, increasing product support, and allowing process customization to meet unique customer needs.

President & CEO of 3D Systems, Dr. Jeffrey Graves, remarked,

We’re pleased to achieve this major milestone which is catalyzing our ability to deliver enhanced quality, and pioneering innovation for our customers. We began our insourcing initiative last year by consolidating the production of multiple polymer 3D printing platforms into our Rock Hill, South Carolina facility.

[Source: GlobeNewswire]

He emphasized that, since undertaking this initiative last year, lead times have shortened each quarter, and they believe that this activity, in conjunction with other actions, puts them on the path to reduce overall inventory by over 20% in 2024.

Dr. Graves stated that they have experienced dramatic improvements in both quality and cost, as well as the ability to accelerate the introduction of new products to meet the market’s continuously evolving needs, while the decision to insource is helping them to better utilize the assets and internal resources, reducing costs that align with their financial commitments to shareholders.

About 3D Systems

3D Systems, a pioneer in the field of 3D printing, offers additive manufacturing solutions, delivering innovation, performance, and dependability in every interaction. Its mission is to enable consumers to realize previously inconceivable products and business models. 3D Systems provides application-specific solutions that leverage the knowledge of their application engineers by providing a comprehensive array of hardware, software, materials, and services. These engineers work closely with consumers to revolutionize the way in which the company delivers its products and services. The solutions of 3D Systems appeal to advanced applications in various sectors.

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MaxLinear Launches Product Design Kit for Active Electrical Cables Using Keystone PAM4 DSP

MaxLinear | February 02, 2024

MaxLinear, Inc. a leading provider of high-speed interconnect ICs enabling data center, metro, and wireless transport networks, announced the availability of a comprehensive product design kit (PDK) to optimize performance and accelerate the time to market for high-speed Active Electrical Cables (AEC) using MaxLinear’s 5nm PAM4 DSP, Keystone. The PDK is a cost-cutting and time-saving tool for cable manufacturers who want to quickly integrate Keystone into their active electrical cables. MaxLinear’s Keystone PAM4 DSP offers a significant power advantage in AEC applications, which is increasingly becoming a critical factor for hyperscale data centers. The use of 5nm CMOS technology enables designers and manufacturers to build high-speed cables that meet the need for low power, highly integrated, high performance interconnect solutions that will drive the next generation of hyperscale cloud networks. Manufacturers taking advantage of MaxLinear’s PDK to optimize cable designs using Keystone PAM4 DSP will gain a distinct advantage over competitor solutions when trying to maximize reach and minimize power consumption. The PDK makes Keystone easy to integrate with strong applications support, multiple tools to optimize and monitor performance, and reference designs (SW and HW) to accelerate integration. Sophisticated software allows for quick design optimization for the lowest possible power consumption and maximizing cable reach. Cable designers can constantly monitor performance, route signals from any port to any port, and take advantage of hitless firmware upgrades. “MaxLinear is focused on providing not only industry-leading interconnect technologies but also a comprehensive suite of tools to support our manufacturing and design partners,” said Drew Guckenberger, Vice President of High Speed Interconnect at MaxLinear. “Our development kit for our Keystone products provides them with a path to take products to market more quickly and more cost-effectively.” Active electrical cables (AECs) are revolutionizing data center connections. Unlike passive cables, they actively boost signals, allowing for longer distances (up to 7 meters for 400G), higher bandwidth, and thinner, lighter cables. This makes them ideal for high-speed applications like top-of-rack connections (connecting switches to servers within the same rack); direct digital control (enabling flexible interconnectivity within racks and across rows); and breakout solutions (splitting high-speed connections into multiple lower-speed channels). The high-speed interconnect market – which includes active optical cables, active electrical cables, direct attach copper cables, and others – is expected to grow to $17.1B by 2028, up from $10.7B in 2021 according to a market forecast report from The Insight Partners. The Keystone Family The Keystone 5nm DSP family caters to 400G and 800G applications, featuring a groundbreaking 106.25Gbps host side electrical I/O, aligning with the line side interface rate. Available variants support single-mode optics (EML and SiPh), multimode optics and Active Electrical Cables (AECs), offering comprehensive solutions with companion TIAs. Host side interfaces cover ethernet rates of 25G, 50G, and 100G per lane over C2M, MR, and LR host channels. The line side interfaces, tailored for 100G/λ DR, FR, and LR applications, also support these rates. These devices boast extensive DSP functionality, encompassing line-side transmitter DPD, TX FIR, receiver FFE, and DFE. With exceptional performance and signal integrity, these DSPs occupy a compact footprint (12mm x 13mm), ideal for next-gen module form-factors like QSFP-DD800 and OSFP800. Additionally, they are available as Known Good Die (KGD) for denser applications, such as OSFP-XD. About MaxLinear, Inc. MaxLinear, Inc. is a leading provider of radio frequency (RF), analog, digital, and mixed-signal integrated circuits for access and connectivity, wired and wireless infrastructure, and industrial and multimarket applications. MaxLinear is headquartered in Carlsbad, California. MaxLinear, the MaxLinear logo, any other MaxLinear trademarks are all property of MaxLinear, Inc. or one of MaxLinear's subsidiaries in the U.S.A. and other countries. All rights reserved.

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