MANUFACTURING TECHNOLOGY

Cincoze Embedded Computers - The Brains Behind Smart Manufacturing

Cincoze | April 26, 2022

Cincoze
Cincoze, a major embedded computer company, believes that growing computing power is critical for enabling smart manufacturing growth in today's industrial manufacturing environment. Thus, in addition to increasing processing performance, Cincoze is constantly enhancing product resilience and offering modular I/O extensions to support various applications. As a result, cincoze computers are ideal for both routine and mission-critical applications in intelligent production, such as autonomous loading and unloading, CNC processing, and automated optical inspection (AOI).

GM-1000—Small and Efficient for Automatic Loading and Unloading
Smart manufacturing requires automatic loading and unloading. The Cincoze GPU Computing GM-1000 is equipped with an Intel® 9th/8th generation workstation-class CPU with an inbuilt MXM 3.1 socket for GPU modules (MXM-RTX3000, MXM-T1000, and MXM-P2000) and other modules, making it the top choice of automation equipment manufacturers. The GM-1000 series provides 360W of power for reliable CPU and GPU operation and has a small footprint of 260 x 200 x 85 mm for convenient integration into autonomous loading and unloading equipment, enabling high-speed, precise material positioning. In addition, the GM-1000 comes equipped with a variety of native I/O, including two GbE LAN ports, four COM ports, USB 3.2 Gen2 and USB 3.2 Gen1, among others, for convenient peripheral connections and data collecting to optimize production productivity.

DS-1300—Highly Flexible PCI/PCIe Expansion for CNC Machines
CNC machines are critical components in the production of precision metals. Cincoze Rugged Computing's DS-1300 series supports a 10th Generation Intel® Xeon®/CoreTM (Comet Lake-S) CPU with up to 10 cores and 80W power consumption, as well as two DDR4 SO-DIMM slots (128GB maximum), delivering the high efficiency and stability required for CNC machine control cabinets, continuous equipment monitoring, and simulating discrete manufacturing processes. In addition, with a 110W power supply, the DS-1300 offers up to two PCI/PCIe expansion slots for image capture, motion capture, or GPU cards. Adjustable PCIe Retainer retains the expansion card during installation and operation in high-vibration equipment.

GP-3000—Flagship Machine Vision Model for 3D AOI Visual Inspection
Automated optical inspection (AOI) ensures the quality of the finished product. Cincoze GPU Computing GP-3000 supports an Intel® Xeon®/CoreTM (Coffee Lake or Coffee Lake) CPU with an integrated Intel® C246 chipset and two DDR4 SO-DIMM slots (DDR4-2666 ECC/non-ECC, 128GB maximum). The 720W total system power consumption and GEB extension box enable the addition of up to two 250W high-end GPU graphics cards for 3D AOI equipment that requires continuous, quick, and precise picture collection and flaw diagnosis. Additionally, the GP-3000 Adjustable 3D GPU Mount ensures that the GPU card remains safe and operates appropriately even in areas with heavy vibration.

Cincoze's Rugged Computing and GPU Computing product lines are perfect for smart manufacturing applications. Their sturdy design operates over a wide temperature range (-40 to 70°C) and voltage range (9-48 VDC), protects against overvoltage, overcurrent, and ESD, and is certified E-mark and EN 50155 (EN 50121-3-2 only). The GM-1000 is shock resistant to 5/50 grams, while the GP-3000 and DS-1300 are MIL-STD-810G certified, making them rugged and reliable for industrial situations.

Spotlight

PolyJet printing is one of the most common Additive Manufacturing printing types used in industry and in labs. PolyJet printing layers are jetted liquid photopolymers that are instantly UV cured to create 3D models that can be handled immediately.

Spotlight

PolyJet printing is one of the most common Additive Manufacturing printing types used in industry and in labs. PolyJet printing layers are jetted liquid photopolymers that are instantly UV cured to create 3D models that can be handled immediately.

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ADDITIVE MANUFACTURING

Metal Additive Manufacturing: Demonstrating the Disruptive Potential of IDTechEx

IDTechEx | May 04, 2022

Since 3D Systems popularized stereolithography thirty years ago, manufacturers of 3D printers that developed their unique technology have followed the same business model: selling their printers to customers. Established and emerging 3D printing companies in metal and polymer additive manufacturing followed a similar path until recently. However, businesses with proprietary technology are beginning to see an alternative. Rather than informing customers about the disruptive potential of their machines, be the disruptor. Decades of an industry operating under the same business model have exposed the inherent issues of selling printers to end customers, particularly metal printers. To begin, consumers must budget for a printer that costs hundreds of thousands of dollars and consumable printing ingredients that cost hundreds of dollars per kilogram. Then, customers must train personnel on how to run the printers and prepare and finish any 3D-printed parts; if the customer lacks the necessary internal resources, trained labor must be hired. Finally, to maximize the value of any 3D printer, consumers must understand how to identify applications where 3D printing provides the greatest value and how to design for these opportunities. In aggregate, these problems contribute to the difficulty of convincing clients to invest in 3D printing, mainly metal additive manufacturing. That is not to say the metal printer install base is stagnant, but instead that this increasingly popular business model fits into a growing industry that IDTechEx forecasts will reach $18.5 billion in revenue by 2032 in their latest report, "Metal Additive Manufacturing 2022-2032: Technology and Market Outlook." A New Strategy – In-House Production Newcomers have noticed the impediments provided by the old business model of supplying metal printers to customers for printing parts. So rather than selling printers based on their patented technology, as standard 3D printer manufacturers do, they have opted for a novel business model in which they retain control of their proprietary printing technique. The 3D printer is not the primary product supplied here; instead, it is the finished 3D-printed parts. This overcomes a number of the traditional barriers to 3D printing adoption, such as high capital costs and the requirement of specialist AM skills. Instead of convincing customers that they can print excellent components if they purchase a 3D printer, in-house production businesses may demonstrate that their proprietary printers can manufacture complicated, custom parts. In this sense, in-house manufacturing enterprises that employ proprietary technologies are comparable to vertically integrated OEMs. Not only do these businesses develop their printing technique and equipment, but they frequently develop the materials for their printers as well. As component manufacturers who deliver finished components to clients, they also perform any necessary post-processing (i.e., depowdering, debinding, sintering, milling, finishing, etc.). Additionally, some companies develop and simulate their software in-house. Vertical integration enables the provision of a comprehensive portfolio of services to end customers – component manufacture, consultancy, and design, for example. The Production Players To Keep An Eye On Most people in the metal additive manufacturing business are familiar with the traditional 3D printer manufacturers that sell printers for part production, such as EOS, SLM Solutions, and ExOne. While many of these companies do have some in-house production, it is not their primary focus and is often done on a limited scale. On the metal additive manufacturing landscape, new entrants with a proprietary method designed especially for in-house production are emerging — who are some of the players to watch? 3DEO is an American start-up that invented Selective Inhibition Sintering, a unique metal binder jetting technique that works similarly to Multi-Jet Fusion and High-Speed Sintering in concept. In this process, an anti-fusing agent is used with the binder to produce high-quality consolidated metal pieces. 3DEO retained Selective Inhibition Sintering in-house to focus on high-volume manufacturing services, challenging for clients purchasing 3D printers. 3DEO announced the printing of their millionth part in 2021. Seurat Technologies is another American start-up making waves in the metal additive manufacturing industry, having raised $79 million as of Q1 2022 to commercialize their proprietary Area Printing technology. Area Printing advances laser powder bed fusion, a method frequently hampered by speed concerns, to increase build volume and part throughput. In addition, Seurat is now engaged in a client adoption program designed to assist customers in identifying critical applications for their technology. Norsk Titanium, the oldest firm on this list, employs its Rapid Plasma Deposition technique exclusively for the in-house manufacture of titanium parts for industrial purposes. Though Norsk has the most focused business of the firms listed, this specialization enables them to focus on high-value verticals with qualification and validation requirements, such as aerospace. Indeed, Boeing is a notable Norsk customer. Relativity Space is an American aerospace firm with over 700 people and a $1.34 billion market capitalization that has developed its metal additive manufacturing technology for rocket manufacture. It's called Stargate and, according to Relativity, it's the world's largest metal 3D printer, capable of manufacturing a single metal object up to 32 feet tall. Relativity uses Stargate to produce components for their rockets. Holo is an Autodesk spin-off company that has developed a technology platform called PureFormTM. PureForm cures photopolymer resin filled with metal powder using a patented vat photopolymerization printer optimized for high volume production, resulting in a green part. This component is then debound and sintered to remove the photopolymer and densify the final metal component. This technology is notable for its suitability for 3D printing pure copper, which is challenging to accomplish with powder bed fusion. Metal additive manufacturing is not the only 3D printing specialty where this method is being used, as seen by the rise of firms like Arevo and Arris Composites in composite 3D printing and OPT Industries and Spectroplast in polymer 3D printing. However, with businesses contemplating alternative revenue models from the outset, IDTechEx anticipates that more additive manufacturing companies will pursue this novel strategy to expand 3D printing adoption. Notably, this form of organization will not supplant traditional service bureaus. On the contrary, service bureaus can be technology-neutral, allowing them to consolidate printers from various processes and businesses into a single entity. With service bureaus like Materialise and Protolabs earning hundreds of millions of dollars in annual revenue, the contract manufacturing segment of the 3D printing business will continue to proliferate. Market forecasts for Metal Additive Manufacturing The IDTechEx research on metal additive manufacturing projects future revenue, install base, and material demand for the metal AM market by segmenting it into ten process categories and nine metal material categories. IDTechEx analyzes each metal printing technology and conducts in-depth market research on metal additive manufacturing materials. For additional information on this market, including profiles of key companies based on interviews, technology benchmarking studies, granular 10-year market estimates, and application case studies, read the IDTechEx market research "Metal Additive Manufacturing 2022-2032: Technology and Market Outlook."

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MANUFACTURING TECHNOLOGY

INC. Magazine Ranks Demco Automation a Top 5000 Fastest-Growing Private American Company

Demco Automation | October 26, 2021

For the third consecutive year, Demco Automation, an industrial robotics and automated manufacturing solutions company based in Quakertown, has grown 142% over that time period to once again earn Inc. Magazine's 5000 List of fastest-growing private companies in America. Stephen Maund, President and CEO of Demco Automation, said the company continues to grow and expand, with 2021 set to be another banner year. He credits their success to "our innovative design techniques that embrace modularity, scalability and flexibility. Demco has been innovators in developing customized processes that can be reconfigurable, effectively extending the useful life of installations." Founded in 1989, Demco Automation develops automated manufacturing systems using new robotic technologies to a growing list of industries, including life science, pharmaceuticals, biotech, medical device, defense, aerospace, electronics, commercial/industrial products, semiconductors, and consumer products. "We approach our customer's specific needs with a clear strategy. Demco is developing processes that have never been automated before using our expertise in new robotic and automation technologies," Maund About Demco Automation Demco Automation is a leading supplier of industrial robotics and automated manufacturing systems to technology-based industry sectors throughout the Americas, Europe, and Asia. Known for its experience in developing innovative modular automation systems and robotics, Demco designs and manufactures all products within its Quakertown, PA facility. Customers include life science, pharmaceuticals, biotech, medical device, defense, aerospace, electronics, commercial/industrial products, semiconductors, and consumer products industries. A civic-minded company, Demco is a multiple HIRE Vets Gold Medallion Award winner from the U.S. Department of Labor; a workforce and education partner with the National Association of Manufacturers (NAM); introduced the Demco Automation Innovation Award inspiring Robotics & Automated Technology Program students; active supporter and promoter of regional STEM educational and vocational programs; exposes regional high school and tech school students to manufacturing with tours and presentations.

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INNOVATION

VIPackTM Is a New Packaging Solution by ASE Enablement

VIPack | June 02, 2022

VIPackTM, a sophisticated packaging platform designed to provide vertically integrated package solutions, was introduced by Advanced Semiconductor Engineering, Inc. (ASE), a subsidiary of ASE Technology Holding Co., Ltd. VIPackTM is the next iteration of ASE's 3D heterogeneous integration architecture, which expands design principles while achieving ultra-high density and performance. To assist companies achieve unparalleled innovation when integrating numerous chips into a single package, the platform uses advanced redistribution layer (RDL) procedures, embedded integration, and 2.5D and 3D technologies. The semiconductor market is growing at an exponential rate as our world moves into the data-centric era, with growth coming from devices used in artificial intelligence (AI), machine learning (ML), 5G communications, high performance computing (HPC), internet-of-things (IoT), and automotive applications. There has never been a greater demand for novel package and IC co-design, cutting-edge wafer-level fabrication techniques, complex packaging technologies, and comprehensive product and testing solutions. As applications demand solutions that offer higher performance, greater functionality, and increased power while meeting rigorous cost limitations, packaging has become increasingly important. Demand for multi-chip integration into a single package is increasing as chiplet-based co-designs become more popular. In environments where 3D heterogeneous integration is vital, VIPackTM creates a collaborative platform for excellent interconnect solutions. VIPackTM is ASE's packaging technology platform, which is supported by a full and integrated co-design environment. These include ASE's RDL-based high-density Fanout Package-on-Package (FOPoP), Fanout Chip-on-Substrate (FOCoS), Fanout Chip-on-Substrate-Bridge (FOCoS-Bridge), and Fanout System-in-Package (FOSiP), as well as TSV-based 2.5D and 3D IC and Co-Packaged Optics processing capabilities. The VIPackTM platform enables groundbreaking, highly integrated silicon packaging solutions that optimize clock speed, bandwidth, and power delivery while reducing co-design time, product development time, and time to market. Critical new innovations such as double-sided RDL have allowed a series of new vertically integrated package technology pillars that create the backbone of our VIPack™ platform.” Mark Gerber, Sr. Director of Technical Marketing and Promotion at ASE. The VIPackTM platform enables dense horizontal and vertical interconnect solutions for disaggregated SoCs and HBM (High Bandwidth Memory) used in cutting-edge HPC, AI, ML, and network applications. High-speed networking is additionally hampered by multiple complicated optical packaging components that necessitate VIPackTM innovation to bring these components together in a vertical structure for both space and performance. VIPackTM supports mobile applications with ultra-low profile SIP modules that solve the common RF iterative design process and offer a greater degree of performance with integrated passives in the RDL layers. Also, the next generation of application processors takes into account the need for lower-profile packaging options and addresses concerns about power delivery in advanced silicon nodes.

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