Adding personalisation to the manufacturing industry’s toolbox

Supply Chain Digital | January 27, 2020

The manufacturing industry is in the midst of a tectonic shift. It doesn’t matter whether a company’s product is automotive, electronic, construction or healthcare related – disruption is rife, largely due to new and emerging technology transforming the industry’s processes. The days of simple assembly lines have been leapfrogged as manufacturers are moving to embrace bold new production and design techniques. From automation and robotics, to 3D-printing and generative design software; there are a number of innovations helping to revolutionise the production line.

Spotlight

Half of all UK business leaders fear that their industries face significant digital disruption within the next two years. Whilst manufacturing is the backbone of the UK economy employing 2.6 million people, the UK Manufacturing Review 2016 is quick to remind that the pace of change toward more automation, digitization and industry 4.0 processes will be rapid.

Spotlight

Half of all UK business leaders fear that their industries face significant digital disruption within the next two years. Whilst manufacturing is the backbone of the UK economy employing 2.6 million people, the UK Manufacturing Review 2016 is quick to remind that the pace of change toward more automation, digitization and industry 4.0 processes will be rapid.

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INNOVATION

VIPackTM Is a New Packaging Solution by ASE Enablement

VIPack | June 02, 2022

VIPackTM, a sophisticated packaging platform designed to provide vertically integrated package solutions, was introduced by Advanced Semiconductor Engineering, Inc. (ASE), a subsidiary of ASE Technology Holding Co., Ltd. VIPackTM is the next iteration of ASE's 3D heterogeneous integration architecture, which expands design principles while achieving ultra-high density and performance. To assist companies achieve unparalleled innovation when integrating numerous chips into a single package, the platform uses advanced redistribution layer (RDL) procedures, embedded integration, and 2.5D and 3D technologies. The semiconductor market is growing at an exponential rate as our world moves into the data-centric era, with growth coming from devices used in artificial intelligence (AI), machine learning (ML), 5G communications, high performance computing (HPC), internet-of-things (IoT), and automotive applications. There has never been a greater demand for novel package and IC co-design, cutting-edge wafer-level fabrication techniques, complex packaging technologies, and comprehensive product and testing solutions. As applications demand solutions that offer higher performance, greater functionality, and increased power while meeting rigorous cost limitations, packaging has become increasingly important. Demand for multi-chip integration into a single package is increasing as chiplet-based co-designs become more popular. In environments where 3D heterogeneous integration is vital, VIPackTM creates a collaborative platform for excellent interconnect solutions. VIPackTM is ASE's packaging technology platform, which is supported by a full and integrated co-design environment. These include ASE's RDL-based high-density Fanout Package-on-Package (FOPoP), Fanout Chip-on-Substrate (FOCoS), Fanout Chip-on-Substrate-Bridge (FOCoS-Bridge), and Fanout System-in-Package (FOSiP), as well as TSV-based 2.5D and 3D IC and Co-Packaged Optics processing capabilities. The VIPackTM platform enables groundbreaking, highly integrated silicon packaging solutions that optimize clock speed, bandwidth, and power delivery while reducing co-design time, product development time, and time to market. Critical new innovations such as double-sided RDL have allowed a series of new vertically integrated package technology pillars that create the backbone of our VIPack™ platform.” Mark Gerber, Sr. Director of Technical Marketing and Promotion at ASE. The VIPackTM platform enables dense horizontal and vertical interconnect solutions for disaggregated SoCs and HBM (High Bandwidth Memory) used in cutting-edge HPC, AI, ML, and network applications. High-speed networking is additionally hampered by multiple complicated optical packaging components that necessitate VIPackTM innovation to bring these components together in a vertical structure for both space and performance. VIPackTM supports mobile applications with ultra-low profile SIP modules that solve the common RF iterative design process and offer a greater degree of performance with integrated passives in the RDL layers. Also, the next generation of application processors takes into account the need for lower-profile packaging options and addresses concerns about power delivery in advanced silicon nodes.

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LEAN MANUFACTURING

Diodes Incorporated Acquires Onsemi's Wafer Fabrication Facility and Operations

Diodes | June 06, 2022

Diodes Incorporated (Diodes) (Nasdaq: DIOD) recently announced that the acquisition of onsemi's wafer fabrication facility and activities in South Portland, Maine ("SPFAB") had been completed. Diodes will combine the South Portland plant and fab operations, including the transfer of SPFAB personnel to Diodes, as previously announced. Diodes will continue to manufacture onsemi's products from SPFAB as part of a multi-year wafer supply deal, while onsemi completes the transition of this manufacturing to its other wafer fabs. We are pleased to successfully complete this transaction, which aligns with our strategic objective for significant revenue and gross profit dollar growth over the next several years, First, I would like to welcome SPFAB employees to the Diodes’ family. The team’s exceptional engineering capabilities and skills will support our technical and operational performance expectations. SPFAB provides additional 200mm wafer fab capacity for analog products to accelerate our growth initiatives in the automotive and industrial end markets." Diodes’ chairman, president and chief executive officer, Dr. Keh-Shew Lu This US-based facility, together with our existing facilities in Asia and Europe, further enhances our global manufacturing footprint and greatly increases Diodes’ internal capacity and competitive advantage in this supply constrained environment, while also supporting our future long-term growth. With the transaction now closed, we aim to aggressively ramp new wafer fab processes and capabilities at SPFAB in alignment with Diodes’ strategic growth plan.” Dr. Keh-Shew Lu further.

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ROBOTICS AND AUTOMATION

UiPath Announces CIO Automation Council to Identify Trends and Advance Democratization of Automation

UiPath | July 12, 2022

UiPath (NYSE: PATH), a leading enterprise automation software company, today announced its inaugural CIO Automation Council comprised of pioneering and innovative CIOs from across industries. Together with leaders from UiPath, the CIO Automation Council endeavors to accelerate automation maturity through sharing best practices; identify new business objectives and market needs for automation; and establish industry benchmarks and provide input to guide industry regulation. The Council is part of UiPath’s broader focus around the CIO, including a CIO Industry Practice dedicated to delivering value to CIOs through education, networking, and thought leadership. “The CIO Automation Council is designed to deepen relationships that help propel the automation industry and strengthen the CIO’s influence both within and outside their organization, The CIO Council members are visionary leaders who will contribute tremendous insights that will directly benefit their peers. We are taking an outcome-based approach to help CIOs realize the possibilities of automation to solve complex enterprise challenges.” -Bobby Patrick, Chief Marketing Officer at UiPath. CIOs are critical decision makers on enterprise solutions and are responsible for maximizing return on technology investments. While CIOs pursue digital modernization, reducing technical debt, and enhancing IT governance and security, they are also facing macroeconomic conditions such as inflation, supply chain disruption, and labor shortages that add difficulty to their roles. In fact, a recent UiPath survey of business executives revealed 78% are very or somewhat likely to invest more in automation to offset the impact of the labor shortage. In addition, a report by IDC predicts that by next year, 60% of CIOs will be primarily measured for their ability to co-create new business models and outcomes through extensive enterprise and ecosystem-wide collaboration. Among the topics the CIO Automation Council will seek to address are expanding and strengthening citizen development and communicating with workers to identify new automations; improving the employee experience through automation to retain talent and attract new talent; and understanding how low code and AI capabilities can take on more advanced use cases with high business impact. The members of the CIO Automation Council include: Vincent Melvin, Arrow Technologies Fumbi Chima, BECU Scott Kessler, BJ's Wholesale Club Steve McMahon, CrowdStrike Lutz Beck, Daimler Truck NAFTA Robert Barrios, E. & J. Gallo Winery Tim Dickson, Generac Power Systems Rajan Kumar, Intuit Leslie Sequeira, Patrick Industries Dr. Zafar Chaudry, Seattle Children's William S. Kehoe, State of Washington Sriram Sitaraman, Synopsys Ryan Kean, Total Quality Logistics Shawnna DelHierro, Visionworks Steve Miller, Xerox Join the UiPath Automation Council members along with other automation leaders and experts at the largest global gathering of automation professionals by registering for UiPath FORWARD 5. About UiPath- UiPath has a vision to deliver the Fully Automated Enterprise™, one where companies use automation to unlock their greatest potential. UiPath offers an end-to-end platform for automation, combining the leading Robotic Process Automation (RPA) solution with a full suite of capabilities that enable every organization to rapidly scale digital business operations.

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