95% of manufacturers say Apprenticeship Levy must be changed to employer-led system

The Manufacturer | July 25, 2019

Industrial employers are calling for an urgent rethink to the governments Apprenticeship Levy to make access to funding more flexible in order to develop the essential skills needed for the future. The call comes on the back of a report by Make UK - An Unlevy playing field for manufacturers, which reveals that 95% of manufacturers want to see the Apprenticeship Levy changed and just 5% happy with the current system. A lack of appropriate apprenticeship training standards training course criteria available to employers to deliver the skills their businesses need is preventing employers from training the new generation of workers, fill vital skills gaps and growing their businesses. Half of manufacturing levy-payers now want to see the Apprenticeship Levy re-worked, giving them the flexibility to spend the levy they pay on all forms of training for all employees, not just apprenticeships.

Spotlight

Touch and tactile sensor are devices which measures the parameters of a contact between the sensor and an object. This interaction obtained is confined to a small defined region. This contrasts with a force and torque sensor that measures the total forces being applied to an object.

Spotlight

Touch and tactile sensor are devices which measures the parameters of a contact between the sensor and an object. This interaction obtained is confined to a small defined region. This contrasts with a force and torque sensor that measures the total forces being applied to an object.

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Dispelix | June 07, 2022

DispelixTM (Espoo), a pioneer in the design and manufacture of next-generation diffractive waveguides, recently announced that it has been working on a family of new reference designs for Augmented Reality (AR) glasses and headsets with respected AR light engine supplier Jade Bird Displays (JBD), for a long time. The new designs combine JBD's cutting-edge MicroLED projectors with the Dispelix LED - an industry-leading pantoscopic waveguide with a superior nanotech coating developed through rigorous collaboration. JBD and Dispelix have combined their expertise in MicroLED displays, light engines, and diffractive waveguide combiners, with at least one cutting-edge model combining binocular waveguides with polychrome MicroLED projectors on the horizon. JBD's AmLEDTM MicroLED projectors for smart eyewear were used in the flagship reference design, and monochrome and various polychrome projector development kits are also available. All of these are intended to assist OEMs and partners in the creation, evaluation, and prototyping of branded smart eyewear (as well as other Augmented Reality (AR) products and solutions) more quickly. The monochromatic projector has a capacity of 0.35cc, a FOV of 30°, a nominal weight of 0.60 grams, and comes in red, green, and blue. It can be used for monochrome smart eyeglasses development or polychrome applications in RGB waveguides with numerous input couplers. The polychrome projector is only 1.3cc in capacity, has a 30° FOV, and weighs 2.3 grams nominally. An x-cube prism is used in the polychrome module projector to merge pictures from three monochrome panels mounted to the faces of the X-cube prism. Both monochrome and polychrome projectors have infinite focus. JBD has launched a number of innovative MicroLED display and projector solutions that are designed into end products such as smart glasses, holographic sights, and sports AR goggles. We are currently expanding our production facilities to support the unprecedented demand for our MicroLED displays and projectors, Our success has only been made possible with the launch of concurrent innovative solutions by our partners, and a stellar example is the Dispelix LED waveguide. Our polychrome projector combined with the LED waveguide will enable OEMs to rapidly turn around small form factor and aesthetically-pleasing AR wearables that are suitable for all day use." Dr. Qiming Li, CEO & Founder of JBD.

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VIPackTM Is a New Packaging Solution by ASE Enablement

VIPack | June 02, 2022

VIPackTM, a sophisticated packaging platform designed to provide vertically integrated package solutions, was introduced by Advanced Semiconductor Engineering, Inc. (ASE), a subsidiary of ASE Technology Holding Co., Ltd. VIPackTM is the next iteration of ASE's 3D heterogeneous integration architecture, which expands design principles while achieving ultra-high density and performance. To assist companies achieve unparalleled innovation when integrating numerous chips into a single package, the platform uses advanced redistribution layer (RDL) procedures, embedded integration, and 2.5D and 3D technologies. The semiconductor market is growing at an exponential rate as our world moves into the data-centric era, with growth coming from devices used in artificial intelligence (AI), machine learning (ML), 5G communications, high performance computing (HPC), internet-of-things (IoT), and automotive applications. There has never been a greater demand for novel package and IC co-design, cutting-edge wafer-level fabrication techniques, complex packaging technologies, and comprehensive product and testing solutions. As applications demand solutions that offer higher performance, greater functionality, and increased power while meeting rigorous cost limitations, packaging has become increasingly important. Demand for multi-chip integration into a single package is increasing as chiplet-based co-designs become more popular. In environments where 3D heterogeneous integration is vital, VIPackTM creates a collaborative platform for excellent interconnect solutions. VIPackTM is ASE's packaging technology platform, which is supported by a full and integrated co-design environment. These include ASE's RDL-based high-density Fanout Package-on-Package (FOPoP), Fanout Chip-on-Substrate (FOCoS), Fanout Chip-on-Substrate-Bridge (FOCoS-Bridge), and Fanout System-in-Package (FOSiP), as well as TSV-based 2.5D and 3D IC and Co-Packaged Optics processing capabilities. The VIPackTM platform enables groundbreaking, highly integrated silicon packaging solutions that optimize clock speed, bandwidth, and power delivery while reducing co-design time, product development time, and time to market. Critical new innovations such as double-sided RDL have allowed a series of new vertically integrated package technology pillars that create the backbone of our VIPack™ platform.” Mark Gerber, Sr. Director of Technical Marketing and Promotion at ASE. The VIPackTM platform enables dense horizontal and vertical interconnect solutions for disaggregated SoCs and HBM (High Bandwidth Memory) used in cutting-edge HPC, AI, ML, and network applications. High-speed networking is additionally hampered by multiple complicated optical packaging components that necessitate VIPackTM innovation to bring these components together in a vertical structure for both space and performance. VIPackTM supports mobile applications with ultra-low profile SIP modules that solve the common RF iterative design process and offer a greater degree of performance with integrated passives in the RDL layers. Also, the next generation of application processors takes into account the need for lower-profile packaging options and addresses concerns about power delivery in advanced silicon nodes.

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MANUFACTURING TECHNOLOGY

Time Manufacturing Company Acquires France Elévateur

France Elévateur | June 28, 2022

H.I.G. Capital ("H.I.G."), a leading global alternative investment firm with over $49 billion of equity capital under management, is pleased to announce that its portfolio company, Time Manufacturing Holdings, LLC (“Time Manufacturing” or the “Company”), a leading, global provider of vehicle-mounted aerial lifts, has acquired France Elévateur (“FE Group”). The pairing of the two companies, who share a mutual dedication to quality and safety, strengthens the combined platform’s global manufacturing capabilities while enhancing value to customers through a broader portfolio of complementary products and services. Founded in 1984 and headquartered in Flavigny, France, France Elévateur is a leading manufacturer of vehicle-mounted aerial platforms for customers in various trades including public lighting, electric utility, roofing, telecommunications, rail networks, and other fields requiring access solutions. Through its two manufacturing sites in France and Spain and its footprint of 15 service facilities, France Elévateur provides quality machinery and comprehensive after-market services across Europe. “The France Elévateur acquisition represents a meaningful step forward in our global growth plan by adding more than 450 experienced professionals, a world-class regional product line, and over a dozen facilities across France, Belgium, and Spain. Leveraging our existing reach in Austria, Denmark, France, Germany, Italy, Sweden, and Switzerland, The FE Group improves our reach in the important national markets of Belgium, Netherlands, Luxembourg, Ireland, Eastern France and Spain.” -Curt Howell, Chief Executive Officer of Time Manufacturing Company. “Together, Time Manufacturing and France Elévateur can leverage their combined portfolio of vehicle-mounted access products to bring additional solutions to all customers.” -Charles Goffin, Chief Executive Officer of France Elévateur. France Elévateur is a highly complementary addition that brings further diversification to Time Manufacturing’s suite of aerial lifts, and strengthens the Company’s global leadership position, said Tenno Tsai, Head of North American Industrials at H.I.G. Klaas Reineke, Managing Director at H.I.G., added, We are thrilled to continue supporting management and the Company in their efforts to enhance our European operations, particularly in the utility and telecommunications end markets. About Time Manufacturing Company- Time Manufacturing Company is a global manufacturer of bucket trucks, digger derricks, cable placers, truck bodies, buckets, and other specialty equipment for electric utility, telecommunications infrastructure, bridge inspection, tree care, and other fleet-supported industries. Selling via the Versalift, BrandFX, Aspen Aerials, Ruthmann, Steiger, Ecoline and Bluelift brands, the Company employs more than 2,000 associates worldwide. For more information, visit https://timemfg.com. About France Elévateur- France Elévateur is a leading manufacturer of vehicle-mounted aerial platforms for customers in various trades including public lighting, electric utility lines, roofing, telecommunications networks, rail networks, equipment rental, and other fields requiring access solutions. Through its two manufacturing sites in France and Spain and its footprint of 15 service facilities, France Elévateur provides quality machinery and after-sales services across Europe. For more information, visit https://france-elevateur.fr. About H.I.G. Capital- H.I.G. is a leading global alternative assets investment firm with over $49 billion of equity capital under management.* Based in Miami, and with offices in New York, Boston, Chicago, Dallas, Los Angeles, San Francisco, and Atlanta in the U.S., as well as international affiliate offices in London, Hamburg, Madrid, Milan, Paris, Bogotá, Rio de Janeiro and São Paulo, H.I.G. specializes in providing both debt and equity capital to small and mid-sized companies, utilizing a flexible and operationally focused/ value-added approach: H.I.G.’s equity funds invest in management buyouts, recapitalizations and corporate carve-outs of both profitable as well as underperforming manufacturing and service businesses. H.I.G.’s debt funds invest in senior, unitranche and junior debt financing to companies across the size spectrum, both on a primary (direct origination) basis, as well as in the secondary markets. H.I.G. is also a leading CLO manager, through its WhiteHorse family of vehicles, and manages a publicly traded BDC, WhiteHorse Finance. H.I.G.’s real estate funds invest in value-added properties, which can benefit from improved asset management practices. H.I.G. Infrastructure focuses on making value-add and core plus investments in the infrastructure sector. Since its founding in 1993, H.I.G. has invested in and managed more than 300 companies worldwide. The firm's current portfolio includes more than 100 companies with combined sales in excess of $30 billion.

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