Examples of Agile Manufacturing to See Why It Is Very Critical

AGILE_MANUFACTURING
An agile manufacturing strategy is one that places a strong priority on responding quickly to the needs of the customer, resulting in a major competitive advantage.

It is a captivating method to build a competitive work system in today's fast-moving marketplace. An agile organization must be able to adapt quickly to take advantage of limited opportunities and rapid shifts as per client demand. Agile manufacturing is gaining favor among manufacturers due to its several benefits, including increased work productivity and good control over the final deliverable. Furthermore, the shorter time to market is expanding the global market for enterprise agile transformation services.

According to Market Watch, with a CAGR of 17.9% from 2019 to 2026, the US enterprise agile transformation services market is predicted to reach $18,189.32 million by 2026.

So why is agile manufacturing gaining traction? What challenges do manufacturers encounter when implementing agile manufacturing, and how have industry leaders like GE, Adobe, and Accenture effectively implemented agile methodology in their organizations and become the best examples of agile manufacturing? In this article, we'll take a closer look at each point.


What Is the Importance of Agile Manufacturing?

The term "agile manufacturing" refers to the use of a variety of different technologies and methodologies in the production process. In order to meet market standards and criteria, organizations must be able to adapt quickly and effectively to their customers' needs by bringing agility to manufacturing. To ensure the quality of products and the cost of production are kept to a minimum, agile manufacturing helps firms to regulate their end product.

Because it immediately addresses the needs and worries of the clients, it is an effective strategy as well. By using this method, firms may better understand the market and use it to their advantage by creating products that meet the needs of their customers.


Challenges While Adopting Agile Methodologies on a Project

When we talk about agile challenges when implementing it on any project, some will be routine and some will be unique. So, let's get a quick grasp on the agile challenges.

Communication about the project: Clear communication between the development team and the product owner is critical throughout the project development life cycle. Any miscommunication can have an impact on the product's quality and the end result of the entire process.

Managing the day-to-day operational challenges: Throughout the project, daily minor or large operations play a significant impact on the overall project output. Any obstacles encountered when working on everyday chores should be resolved immediately to avoid any delays or halts in the process.

To make it function, you'll need experience: Any inexperienced product owners, scrum masters, or individuals new to the agile approach may have a negative impact on the project's expected output.

Various project contributors' buy-in: Inadequate training, a lack of motivation to show up from project participants, keeping customers in the loop, and a lack of departmental management are some of the problems that may hinder the accurate implementation of the agile methodology. The presence of one or more of these obstacles in any business or project may jeopardize the agile methodology and its total output.

Though there are many online training courses and books available on how to integrate agile practices into your project, each organization's scenario is unique, as are the challenges they encounter. As a result, handling the situation with experienced personnel that have a can-do attitude is what is required to make it work.

Following that, we'll look at some manufacturing business agile examples and how they've successfully implemented agile methodology in their organizations.


Agile Manufacturing Examples

We'll look at one of the most well-known industrial examples of agile manufacturing that has successfully implemented the methodology and achieved great outcomes. Take a peek at it.


Adobe

One of the most popular agile manufacturing examples in performance management revamps is Adobe. When Donna Morris was Senior Vice President of People Resources in 2012, she thought the annual performance evaluation and the stack-ranking process were bureaucratic, paperwork-heavy overly complicated, taking up too many management hours for the company. Aside from this, she discovered that it set barriers to joint efforts, creativity, and development.

The Adobe team ditched annual performance reviews and encouraged managers and employees to regularly discuss performance via a system called “Check-in.” Adobe has reduced voluntary turnover by 30% and increased voluntary departures by 50% since making the transition. Moreover, the company saved 80,000 management hours annually.


General Electric

General Electric famously overhauled its performance management system in 2015, paving the path for other global firms to follow in the electronics industry. Annual performance evaluations and the infamous rank-and-yank performance rating system (ranking employees and regularly eliminating the bottom 10%) had GE decide they needed to update their performance management system. The annual appraisals lasted a decade longer than the ranking system. They are now a more agile organization.

Instead of directing employees to attain goals, managers now guide and coach them. GE also decided to deploy an app they designed called PD@GE to facilitate regular employee feedback and productive performance discussions.

Using the app, each employee establishes priorities and solicits feedback. They can also give real-time feedback. Employees can request a face-to-face meeting at any time to discuss transparency, honesty, and continuous improvement.

These traits will not arise quickly and will require motivation and commitment for self-growth.


Accenture

According to Accenture's previous system, employees who perform well tend to be the most narcissists and self-promoters. Accenture wanted to revamp their system and reward genuine employees. So they started using on-going performance conversations while focusing on performance development.

Because it required employees to compete with coworkers who may have had a different position, Accenture decided that forced ranking was illogical. The new system is more centered on the employee and aims to assist them in becoming the best version of themselves.


Final Words

Agile manufacturing is a way to get the finest results and exceed client expectations on every project. Businesses are benefiting from agile manufacturing because it improves the end product and helps them better utilize their resources. The necessity of agile manufacturing in business is vital, and organizations must overcome the challenges they encounter while applying the agile approach to any of their projects in order to reap the benefits of agile production.


FAQ


How does agile manufacturing help businesses?

An agile manufacturing process enables organizations to respond to client requests with flexibility when market conditions change, as well as regulate their intended production while preserving product quality and minimizing costs.


What is an agile organization?

Unified alignment, accountability, specialization, transparency, and cooperation are key elements in an agile organization. To guarantee these teams can work efficiently, the organization must maintain a solid environment.


What are the core elements of agility?

Individuals and interactions over processes and tools are the four values of the Agile Methodology. A working program is preferable to in-depth documentation. During contract negotiation, the customer's cooperation is valued.

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Inadequate Additive Manufacturing Infrastructure Inadequate infrastructure stands as a significant barrier, impeding the efficient management of 3D printing operations in numerous companies. The substantial financial outlay for software, materials, training, and facility setup poses a significant barrier, despite the potential benefits of AM. Inefficiencies and errors during the production process emerge due to the lack of integration. Collaborative efforts with AM hardware and software providers can lead to integrated solutions, streamlining workflows and enhancing user experience. Let’s understand infrastructure challenges in 3D printing in greater detail: 4.1 Limited Digital Infrastructure Insufficient digital infrastructure hampers the efficient management of 3D printing operations in many companies. This deficiency spans across various software aspects, including design, simulation, process optimization, and production management. As a result, workflows become disjointed, leading to inefficiencies and increased production costs. To tackle this challenge, businesses need to invest in specialized workflow management software tailored for 3D printing operations. Such software enables centralized production planning, better traceability, and data synchronization between systems, simplifying the integration of 3D printing into digital manufacturing environments. 4.2 High Initial Investment The adoption of additive manufacturing (AM) requires substantial financial resources beyond equipment acquisition. This encompasses investment in software, materials, employee training, post-processing equipment, certification, and facility setup. The significant upfront investment often discourages organizations from embracing AM technology, despite its potential benefits. However, efforts are underway to make AM more accessible, with the development of entry-level 3D printers at a fraction of the cost of high-end systems. These initiatives aim to democratize AM technology and make it more feasible for businesses to invest in. 4.3 Workflow Integration Issues The fragmented nature of the AM ecosystem poses challenges in workflow integration. Companies struggle to navigate disparate solutions and synchronize them effectively. This lack of integration leads to inefficiencies, operational complexity, and higher chances of errors during the production process. To address this, companies are collaborating with AM hardware and software providers to develop integrated solutions that streamline workflows and enhance user experience to deal with common challenges in additive manufacturing. Additionally, efforts to consolidate the AM value chain are underway, aiming to simplify the adoption of AM technology. 5. Technical Hurdles As enthusiasts and professionals alike delve deeper into this captivating technology, encountering common technical issues is inevitable. Let’s understand the most prevalent problems encountered in both FDM (Fused Deposition Modeling) and SLA (Stereolithography) 3D printing processes, and get equipped with the knowledge and solutions needed to transcend obstacles and achieve printing perfection. 5.1 FDM Printing Inconsistencies Inconsistent layer adhesion manifests as visible seams or weak bonds between layers, compromising the structural integrity of prints. Warping and curling occur when corners or edges of prints lift from the print bed, resulting in misshapen or failed prints. Also, extrusion problems, such as under-extrusion or over-extrusion, lead to incomplete or excessive deposition of filament, resulting in flawed prints. 5.2 SLA Printing Concerns Incomplete curing of resin results in soft, tacky prints with poor surface finish and reduced mechanical strength. Delamination can also happen when layers of a 3D print fail to adhere properly, resulting in visible cracks or separation between the printed layers. Various causes like inadequate bonding between layers due to improper print settings, insufficient material compatibility, inadequate surface preparation, or variations in temperature during printing resulting in differential cooling rates between layers can exacerbate adhesion issues and promote delamination. 5.3 Production Speed One of the primary reasons behind the slower production speed in 3D printing is the layer-by-layer additive manufacturing process. Unlike subtractive manufacturing techniques that can rapidly carve out a final product from a block of material, 3D printing builds objects layer by layer, which inherently takes more time. Additionally, factors such as intricate geometries, print resolution, and material properties can further slow down the printing process. 5.4 Streamlining Post-Production Post-processing activities, including cleaning, finishing, and support removal, present intricate obstacles that impede efficiency and elevate costs. One critical aspect of post-production in 3D printing is the removal of support structures. While necessary for printing complex geometries, these structures often leave behind residues that require meticulous manual labor to eliminate. Such manual intervention not only prolongs lead times but also escalates production costs, diminishing the cost-effectiveness of additive manufacturing. Moreover, achieving the desired surface finish on 3D printed parts poses another challenge in post-processing. Depending on the application, parts may require smoothing, polishing, or coating to meet quality standards. Manual finishing techniques are time-consuming and labor-intensive, demanding skilled personnel and specialized equipment. 5.5 Quality Concerns Quality discrepancies in 3D printed parts can have far-reaching consequences, manifesting as functional defects, structural weaknesses, and compromised performance. These issues not only erode product integrity but also escalate the risk of product failure, liability, and associated costs. Additionally, inconsistent quality presents hurdles in regulatory compliance and certification processes, impeding market acceptance and scalability. Notably, issues stemming from bad filament quality, be it due to variations in diameter or length, result in dismal material extrusion rates, yielding substandard 3D prints with potential business ramifications. Such discrepancies can wreak havoc on hardware, especially the extruder, where thin filament leads to inadequate pressure and wide filament strains the extruder motor or hot end opening, thereby jeopardizing 3D printer functionality and print quality. 6. Workforce Skillgaps One of the primary facets of 3D printing workforce skills gap revolves around technical proficiency. Mastery of CAD software, for instance, is paramount for effective 3D modeling and design. Additionally, expertise in slicing software, which translates 3D models into printable instructions, is essential. Understanding the intricacies of various printing materials is crucial for successful 3D printing operations. Workforce skill gaps must be addressed to realize the full potential of 3D printing. 6.1 Complexity of AM Processes 3D printing involves complex processes such as design optimization to fuel innovation easily with additive manufacturing techniques, material selection, and machine operation. Business leaders must recognize the technical nuances of AM and invest in comprehensive training programs to equip their resources with the necessary skills. Skills in digital design, CAD modeling, materials science, and additive manufacturing principles are essential for effective utilization of 3D printing. 6.2 Integration with Existing Workflows Integrating 3D printing into existing manufacturing workflows requires a deep understanding of production processes and supply chain dynamics. Cross-functional collaboration and interdisciplinary training can ensure alignment between 3D printing initiatives and organizational objectives. Also, skill gaps may emerge as new materials, processes, and applications are introduced, requiring proactive measures to stay abreast of industry developments. Engaging with industry experts, research institutions, and educational organizations can provide valuable insights and resources for skill development 7. Strategic Solutions for 3D Printing Challenges Despite 3D printing software challenges, the industry is evolving rapidly, with advancements in technology, materials, and automation. Efforts to bridge knowledge gaps and foster partnerships indicate a promising future for the industry. Companies are actively investing in research and development to overcome existing limitations and unlock the full potential of additive manufacturing. Following are some precise solutions for diverse 3D printing challenges: 7.1 Technical Hurdles Technical challenges in 3D printing are akin to solving a multidimensional puzzle where each piece represents a variable in printing precision, software compatibility, and hardware reliability. Overcoming these challenges is critical for advancing the capabilities of additive manufacturing. These difficulties serve as both a barrier and a catalyst for growth. Addressing them requires a deep dive into the complex interplay between software settings, material behavior, and printer mechanics. 7.2 Material Challenges Material constraints in 3D printing span beyond just availability, touching on aspects of cost, performance, and environmental impact. These can restrict 3D printing's application across various industries. Bridging this gap involves exploring new material compositions and enhancing existing ones to meet specific requirements. The quest for the perfect print material parallels the search for the holy grail in 3D printing. 7.3 Financial Challenges Securing the financial foundations of 3D printing projects is a daunting challenge that requires a delicate balance between innovation, cost-efficiency, and market demand. Overcoming these obstacles is key to the technology's broader adoption. These hurdles underscore the importance of efficient cost management and investment in innovation. Strategic financial management leads to sustainable business growth with 3D printing processes. 7.4 Infrastructural Issues Infrastructural challenges in 3D printing, including inadequate digital frameworks as well as integration issues, highlight the need for cohesive systems that streamline the entire manufacturing process from design to production. Building robust infrastructures is crucial for operational excellence. This includes the development of advanced digital ecosystems and the integration of seamless workflows. 7.5 Quality Problems Quality-related challenges in 3D printing, such as inconsistencies in part strength and surface finish, underscore the necessity for stringent quality control measures and continuous technological refinement. Achieving high-quality outputs in 3D printing is a multifaceted challenge that demands attention to detail in every aspect of the printing process, from material selection to post-processing techniques. 7.6 Skill Gaps Bridging the skills gap in 3D printing involves addressing the shortage of technical proficiency and fostering an environment of continuous learning and innovation within the workforce. The rapid evolution of 3D printing technology presents this formidable challenge of keeping the workforce adept and well-versed in the latest techniques, necessitating ongoing education and skill development through training programs. 8. 3D Printing's Impact on Future of Manufacturing 3D printing, a transformative force in manufacturing, is reshaping the industry by offering unparalleled efficiency, sustainability, and the potential for customization. This technology is making significant strides, especially in sectors like housing and construction, with innovations from startups such as Tvasta, and extending its influence to the electronics sector through the creation of complex, customized components. The adaptability and cost-effectiveness of 3D printing promises to revolutionize manufacturing processes, moving toward more personalized and customized production, thereby enhancing product quality and fostering innovation in design. However, the journey of 3D printing toward becoming a cornerstone of future manufacturing is not without 3D printing software challenges. These hurdles encompass a range of technical challenges in 3D printing, from 3D printing material limitations to skill gap challenges in additive manufacturing. Addressing these common challenges in additive manufacturing require a methodical plan to find strategic solutions for 3D printing challenges. Looking into the future of 3D printing technology, it's clear that despite 3D printing problems and solutions, the industry is poised for growth, driven by advance 3D printing technology and an innovative approach to overcoming 3D printing challenges. The opportunities and challenges of 3D printing highlight the need for continuous learning, cross-sector collaboration, and investment in technology development to surmount cost challenges in additive manufacturing and material limitations. As we anticipate 3D printing in the coming year, it's crucial to address the biggest challenges within 3D printing processes, which point towards the necessity for industry-wide efforts to address 3D printing issues and ensure a sustainable, efficient future for manufacturing. The potential intellectual property challenges underscore the complexity of 3D printing's impact on future manufacturing. The ease of reproducing protected intellectual property through 3D printing calls for safeguarding companies' interests and ensuring the integrity of the supply chain and product quality. Licensing opportunities present a way forward, aligning production with demand and potentially reducing costs. In summary, while 3D printing's impact on future manufacturing is profound, successfully navigating its path requires addressing both the primary and secondary challenges it presents. Embracing strategic solutions to these challenges will enable the industry to unlock the full potential of 3D printing, marking a new era of manufacturing characterized by efficiency, customization, and innovation.

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DoALL Sawing Products, found in thousands of machine shops across the world, range from industrial machines for high production to general purpose, miter cutting, vertical contour, horizontal structural, circular saws, specialty saws and custom engineered machines.

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MaxLinear Launches Product Design Kit for Active Electrical Cables Using Keystone PAM4 DSP

MaxLinear | February 02, 2024

MaxLinear, Inc. a leading provider of high-speed interconnect ICs enabling data center, metro, and wireless transport networks, announced the availability of a comprehensive product design kit (PDK) to optimize performance and accelerate the time to market for high-speed Active Electrical Cables (AEC) using MaxLinear’s 5nm PAM4 DSP, Keystone. The PDK is a cost-cutting and time-saving tool for cable manufacturers who want to quickly integrate Keystone into their active electrical cables. MaxLinear’s Keystone PAM4 DSP offers a significant power advantage in AEC applications, which is increasingly becoming a critical factor for hyperscale data centers. The use of 5nm CMOS technology enables designers and manufacturers to build high-speed cables that meet the need for low power, highly integrated, high performance interconnect solutions that will drive the next generation of hyperscale cloud networks. Manufacturers taking advantage of MaxLinear’s PDK to optimize cable designs using Keystone PAM4 DSP will gain a distinct advantage over competitor solutions when trying to maximize reach and minimize power consumption. The PDK makes Keystone easy to integrate with strong applications support, multiple tools to optimize and monitor performance, and reference designs (SW and HW) to accelerate integration. Sophisticated software allows for quick design optimization for the lowest possible power consumption and maximizing cable reach. Cable designers can constantly monitor performance, route signals from any port to any port, and take advantage of hitless firmware upgrades. “MaxLinear is focused on providing not only industry-leading interconnect technologies but also a comprehensive suite of tools to support our manufacturing and design partners,” said Drew Guckenberger, Vice President of High Speed Interconnect at MaxLinear. “Our development kit for our Keystone products provides them with a path to take products to market more quickly and more cost-effectively.” Active electrical cables (AECs) are revolutionizing data center connections. Unlike passive cables, they actively boost signals, allowing for longer distances (up to 7 meters for 400G), higher bandwidth, and thinner, lighter cables. This makes them ideal for high-speed applications like top-of-rack connections (connecting switches to servers within the same rack); direct digital control (enabling flexible interconnectivity within racks and across rows); and breakout solutions (splitting high-speed connections into multiple lower-speed channels). The high-speed interconnect market – which includes active optical cables, active electrical cables, direct attach copper cables, and others – is expected to grow to $17.1B by 2028, up from $10.7B in 2021 according to a market forecast report from The Insight Partners. The Keystone Family The Keystone 5nm DSP family caters to 400G and 800G applications, featuring a groundbreaking 106.25Gbps host side electrical I/O, aligning with the line side interface rate. Available variants support single-mode optics (EML and SiPh), multimode optics and Active Electrical Cables (AECs), offering comprehensive solutions with companion TIAs. Host side interfaces cover ethernet rates of 25G, 50G, and 100G per lane over C2M, MR, and LR host channels. The line side interfaces, tailored for 100G/λ DR, FR, and LR applications, also support these rates. These devices boast extensive DSP functionality, encompassing line-side transmitter DPD, TX FIR, receiver FFE, and DFE. With exceptional performance and signal integrity, these DSPs occupy a compact footprint (12mm x 13mm), ideal for next-gen module form-factors like QSFP-DD800 and OSFP800. Additionally, they are available as Known Good Die (KGD) for denser applications, such as OSFP-XD. About MaxLinear, Inc. MaxLinear, Inc. is a leading provider of radio frequency (RF), analog, digital, and mixed-signal integrated circuits for access and connectivity, wired and wireless infrastructure, and industrial and multimarket applications. MaxLinear is headquartered in Carlsbad, California. MaxLinear, the MaxLinear logo, any other MaxLinear trademarks are all property of MaxLinear, Inc. or one of MaxLinear's subsidiaries in the U.S.A. and other countries. All rights reserved.

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Smart Factory

PsiQuantum, Mitsubishi UFJ Financial Group and Mitsubishi Chemical Announce Partnership to Design Energy-Efficient Materials on PsiQuantum’s

PsiQuantum | January 30, 2024

PsiQuantum and Mitsubishi UFJ Financial Group announced that they are beginning work with Mitsubishi Chemical Group on a joint project to simulate excited states of photochromic molecules which have widespread industrial and residential potential applications such as the development of smart windows, energy-efficient data storage, solar energy storage and solar cells, and other photoswitching use cases. Qlimate, a PsiQuantum-led initiative that includes MUFG as a partner, focuses on using fault-tolerant quantum computing to crack the most challenging computational problems and accelerate the development of scalable breakthroughs across climate technologies, including more energy-efficient materials. Mitsubishi UFJ Financial Group (MUFG) is committed to supporting the world’s transition to a sustainable future, and to encourage industry access to the most promising breakthrough technologies. By pioneering PsiQuantum’s Qlimate solutions with industry leader Mitsubishi Chemical, MUFG is at the forefront of quantum computing for sustainability. This joint project will determine whether high-accuracy estimates of excited state properties are feasible on early-generation fault-tolerant quantum computers, specifically focusing on diarylethenes used for energy-efficient photoswitching applications. The project will allow Mitsubishi Chemical to gain early insights into how and when fault-tolerant quantum computing can be deployed in support of critical, scalable, sustainable materials. Because predicting the optical properties of materials requires complex analysis of excited states, standard algorithmic techniques for simulating these molecules (such as the Density Functional Theory, or DFT) often produce qualitatively incorrect results. The project will bring together Mitsubishi Chemical’s deep experience of computational chemistry and PsiQuantum’s leading expertise in fault-tolerant quantum computing to push the boundaries of approaching the complex physics in these systems and pave the way to developing new, more powerful energy-efficient photonic materials. Philipp Ernst, Head of Solutions at PsiQuantum, said: “PsiQuantum has dedicated teams who identify, describe and solve complex problem sets with best-in-class quantum algorithms. These are designed specifically to run on fault-tolerant quantum computers and will tackle previously-impossible computational challenges. This partnership will leverage our team’s unique know-how and Mitsubishi Chemical’s expertise in photochromic materials. We are grateful for MUFG’s visionary support in our mission to deploy high-impact quantum computing solutions to fight climate change.” Suguru Azegami, Managing Director, Sustainable Business Division, MUFG said: “We are excited to partner with PsiQuantum and Mitsubishi Chemical on our journey to explore possibilities of quantum computing technologies to solve the imminent global challenge. PsiQuantum’s vision to develop the first utility scale quantum computer before the end of the decade has inspired us, which led our initiative to participate in the Qlimate partnership as the first and sole member from Japan. Mitsubishi Chemical is leading efforts to use the cutting-edge technology to develop next generation materials and we are honored to support the company as its long term financial partner.” Qi Gao, Senior Chief Scientist, Mitsubishi Chemical said: “We are pleased to be part of the partnership and are grateful for MUFG’s support. Mitsubishi Chemical’s over 40 years background in computational chemistry and PsiQuantum’s domain specific knowledge for quantum control is a great fit with the collaboration effort of improving calculation accuracy on quantum device. We hope the partnership will accelerate the innovation of revolutionizing computational studies in chemistry and materials science.” About PsiQuantum PsiQuantum is a private company, founded in 2015 and headquartered in Palo Alto, California. The company’s only mission is to build and deploy the world’s first useful, large-scale quantum computer. Many teams around the world today have demonstrated prototype quantum computing systems, but it is widely accepted that much larger systems are necessary in order to unlock transformational applications across drug discovery, climate technologies, finance, transportation, security & defense and beyond. PsiQuantum’s photonic approach enables rapid scaling via direct leverage of high-volume semiconductor manufacturing and cryogenic infrastructure. The company is partnered with the SLAC National Accelerator Laboratory at Stanford University and Sci-Tech Daresbury in the United Kingdom. About Mitsubishi UFJ Financial Group, Inc. (MUFG) Mitsubishi UFJ Financial Group, Inc. (MUFG) is one of the world’s leading financial groups. Headquartered in Tokyo and with over 360 years of history, MUFG has a global network with approximately 2,000 locations in more than 50 countries. The Group has about 160,000 employees and offers services including commercial banking, trust banking, securities, credit cards, consumer finance, asset management, and leasing. The Group aims to “be the world’s most trusted financial group” through close collaboration among our operating companies and flexibly respond to all of the financial needs of our customers, serving society, and fostering shared and sustainable growth for a better world. MUFG’s shares trade on the Tokyo, Nagoya, and New York stock exchanges. About the Mitsubishi Chemical Group Corporation Mitsubishi Chemical Group Corporation (TSE: 4188) is a specialty materials group with an unwavering commitment to lead with innovative solutions to achieve KAITEKI, the well-being of people and the planet. We bring deep expertise and material science leadership in core market segments such as mobility, digital, medical and food. In this way, we enable industry transformation, technology breakthroughs, and longer, more fruitful lives for us all. Together, around 70,000 employees worldwide provide advanced chemistry-based solutions to deliver the core elements of our slogan — “Science. Value. Life.”

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Additive Manufacturing

Teledyne Relays Unveils Innovative Multi-Function Timer Series

Teledyne Relays, Inc. | January 29, 2024

Teledyne Relays, a leading provider of cutting-edge relay solutions, introduces its new Multi-Function Timer product series, showcasing the company's commitment to delivering advanced, reliable, and versatile solutions for the industrial automation sector. Teledyne Relays Multi-Function Timer MFT series is a state-of-the-art solution designed for a wide variety of applications that demand precise timing control. The user-friendly design features three potentiometers for easy selection of timing functions and ranges, while the LEDs provide at-a-glance feedback of timing and relay status. The MFT series also features 7 selectable timing functions for a wide variety of applications Timing ranges from 0.1 seconds up to 100 hours Compact 17.5mm housing preserves valuable panel space Supply Voltages: 24VDC & 24-240VAC OR 12-240VAC/DC 5A SPDT output relay Engineered with the needs of electrical engineers, panel builders, and automation engineers in mind, these timers find application in various industries, including but not limited to Industrial Automation Manufacturing Process Control Systems HVAC and Refrigeration Agriculture and Irrigation Power Distribution “With the new Multi-Function Timer series, Teledyne Relays continues to lead in providing reliable and versatile solutions for industrial automation, ensuring precise timing control,” said Michael Palakian, Vice President of Global Sales and Marketing at Teledyne Relays. The Multi-Function Timer series from Teledyne Relays ensures precise timing control, offering unparalleled reliability across diverse applications and is available for ordering from Teledyne Relays or an authorized distributor. About Teledyne Relays Teledyne Relays is a world leader in high-performance coaxial switches, electromechanical, and solid-state relays, offering a wide range of solutions for various applications in the aerospace and defense, telecommunications, test and measurement, and industrial markets. With over 60 years of experience, Teledyne Relay has established a reputation for quality, reliability, and customer service excellence. About Teledyne Defense Electronics Serving Defense, Space and Commercial sectors worldwide, Teledyne Defense Electronics offers a comprehensive portfolio of highly engineered solutions that meet your most demanding requirements in the harshest environments. Manufacturing both custom and off-the-shelf product offerings, our diverse product lines meet emerging needs for key applications for avionics, energetics, electronic warfare, missiles, radar, satcom, space and test and measurement.

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Manufacturing Technology

MaxLinear Launches Product Design Kit for Active Electrical Cables Using Keystone PAM4 DSP

MaxLinear | February 02, 2024

MaxLinear, Inc. a leading provider of high-speed interconnect ICs enabling data center, metro, and wireless transport networks, announced the availability of a comprehensive product design kit (PDK) to optimize performance and accelerate the time to market for high-speed Active Electrical Cables (AEC) using MaxLinear’s 5nm PAM4 DSP, Keystone. The PDK is a cost-cutting and time-saving tool for cable manufacturers who want to quickly integrate Keystone into their active electrical cables. MaxLinear’s Keystone PAM4 DSP offers a significant power advantage in AEC applications, which is increasingly becoming a critical factor for hyperscale data centers. The use of 5nm CMOS technology enables designers and manufacturers to build high-speed cables that meet the need for low power, highly integrated, high performance interconnect solutions that will drive the next generation of hyperscale cloud networks. Manufacturers taking advantage of MaxLinear’s PDK to optimize cable designs using Keystone PAM4 DSP will gain a distinct advantage over competitor solutions when trying to maximize reach and minimize power consumption. The PDK makes Keystone easy to integrate with strong applications support, multiple tools to optimize and monitor performance, and reference designs (SW and HW) to accelerate integration. Sophisticated software allows for quick design optimization for the lowest possible power consumption and maximizing cable reach. Cable designers can constantly monitor performance, route signals from any port to any port, and take advantage of hitless firmware upgrades. “MaxLinear is focused on providing not only industry-leading interconnect technologies but also a comprehensive suite of tools to support our manufacturing and design partners,” said Drew Guckenberger, Vice President of High Speed Interconnect at MaxLinear. “Our development kit for our Keystone products provides them with a path to take products to market more quickly and more cost-effectively.” Active electrical cables (AECs) are revolutionizing data center connections. Unlike passive cables, they actively boost signals, allowing for longer distances (up to 7 meters for 400G), higher bandwidth, and thinner, lighter cables. This makes them ideal for high-speed applications like top-of-rack connections (connecting switches to servers within the same rack); direct digital control (enabling flexible interconnectivity within racks and across rows); and breakout solutions (splitting high-speed connections into multiple lower-speed channels). The high-speed interconnect market – which includes active optical cables, active electrical cables, direct attach copper cables, and others – is expected to grow to $17.1B by 2028, up from $10.7B in 2021 according to a market forecast report from The Insight Partners. The Keystone Family The Keystone 5nm DSP family caters to 400G and 800G applications, featuring a groundbreaking 106.25Gbps host side electrical I/O, aligning with the line side interface rate. Available variants support single-mode optics (EML and SiPh), multimode optics and Active Electrical Cables (AECs), offering comprehensive solutions with companion TIAs. Host side interfaces cover ethernet rates of 25G, 50G, and 100G per lane over C2M, MR, and LR host channels. The line side interfaces, tailored for 100G/λ DR, FR, and LR applications, also support these rates. These devices boast extensive DSP functionality, encompassing line-side transmitter DPD, TX FIR, receiver FFE, and DFE. With exceptional performance and signal integrity, these DSPs occupy a compact footprint (12mm x 13mm), ideal for next-gen module form-factors like QSFP-DD800 and OSFP800. Additionally, they are available as Known Good Die (KGD) for denser applications, such as OSFP-XD. About MaxLinear, Inc. MaxLinear, Inc. is a leading provider of radio frequency (RF), analog, digital, and mixed-signal integrated circuits for access and connectivity, wired and wireless infrastructure, and industrial and multimarket applications. MaxLinear is headquartered in Carlsbad, California. MaxLinear, the MaxLinear logo, any other MaxLinear trademarks are all property of MaxLinear, Inc. or one of MaxLinear's subsidiaries in the U.S.A. and other countries. All rights reserved.

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Smart Factory

PsiQuantum, Mitsubishi UFJ Financial Group and Mitsubishi Chemical Announce Partnership to Design Energy-Efficient Materials on PsiQuantum’s

PsiQuantum | January 30, 2024

PsiQuantum and Mitsubishi UFJ Financial Group announced that they are beginning work with Mitsubishi Chemical Group on a joint project to simulate excited states of photochromic molecules which have widespread industrial and residential potential applications such as the development of smart windows, energy-efficient data storage, solar energy storage and solar cells, and other photoswitching use cases. Qlimate, a PsiQuantum-led initiative that includes MUFG as a partner, focuses on using fault-tolerant quantum computing to crack the most challenging computational problems and accelerate the development of scalable breakthroughs across climate technologies, including more energy-efficient materials. Mitsubishi UFJ Financial Group (MUFG) is committed to supporting the world’s transition to a sustainable future, and to encourage industry access to the most promising breakthrough technologies. By pioneering PsiQuantum’s Qlimate solutions with industry leader Mitsubishi Chemical, MUFG is at the forefront of quantum computing for sustainability. This joint project will determine whether high-accuracy estimates of excited state properties are feasible on early-generation fault-tolerant quantum computers, specifically focusing on diarylethenes used for energy-efficient photoswitching applications. The project will allow Mitsubishi Chemical to gain early insights into how and when fault-tolerant quantum computing can be deployed in support of critical, scalable, sustainable materials. Because predicting the optical properties of materials requires complex analysis of excited states, standard algorithmic techniques for simulating these molecules (such as the Density Functional Theory, or DFT) often produce qualitatively incorrect results. The project will bring together Mitsubishi Chemical’s deep experience of computational chemistry and PsiQuantum’s leading expertise in fault-tolerant quantum computing to push the boundaries of approaching the complex physics in these systems and pave the way to developing new, more powerful energy-efficient photonic materials. Philipp Ernst, Head of Solutions at PsiQuantum, said: “PsiQuantum has dedicated teams who identify, describe and solve complex problem sets with best-in-class quantum algorithms. These are designed specifically to run on fault-tolerant quantum computers and will tackle previously-impossible computational challenges. This partnership will leverage our team’s unique know-how and Mitsubishi Chemical’s expertise in photochromic materials. We are grateful for MUFG’s visionary support in our mission to deploy high-impact quantum computing solutions to fight climate change.” Suguru Azegami, Managing Director, Sustainable Business Division, MUFG said: “We are excited to partner with PsiQuantum and Mitsubishi Chemical on our journey to explore possibilities of quantum computing technologies to solve the imminent global challenge. PsiQuantum’s vision to develop the first utility scale quantum computer before the end of the decade has inspired us, which led our initiative to participate in the Qlimate partnership as the first and sole member from Japan. Mitsubishi Chemical is leading efforts to use the cutting-edge technology to develop next generation materials and we are honored to support the company as its long term financial partner.” Qi Gao, Senior Chief Scientist, Mitsubishi Chemical said: “We are pleased to be part of the partnership and are grateful for MUFG’s support. Mitsubishi Chemical’s over 40 years background in computational chemistry and PsiQuantum’s domain specific knowledge for quantum control is a great fit with the collaboration effort of improving calculation accuracy on quantum device. We hope the partnership will accelerate the innovation of revolutionizing computational studies in chemistry and materials science.” About PsiQuantum PsiQuantum is a private company, founded in 2015 and headquartered in Palo Alto, California. The company’s only mission is to build and deploy the world’s first useful, large-scale quantum computer. Many teams around the world today have demonstrated prototype quantum computing systems, but it is widely accepted that much larger systems are necessary in order to unlock transformational applications across drug discovery, climate technologies, finance, transportation, security & defense and beyond. PsiQuantum’s photonic approach enables rapid scaling via direct leverage of high-volume semiconductor manufacturing and cryogenic infrastructure. The company is partnered with the SLAC National Accelerator Laboratory at Stanford University and Sci-Tech Daresbury in the United Kingdom. About Mitsubishi UFJ Financial Group, Inc. (MUFG) Mitsubishi UFJ Financial Group, Inc. (MUFG) is one of the world’s leading financial groups. Headquartered in Tokyo and with over 360 years of history, MUFG has a global network with approximately 2,000 locations in more than 50 countries. The Group has about 160,000 employees and offers services including commercial banking, trust banking, securities, credit cards, consumer finance, asset management, and leasing. The Group aims to “be the world’s most trusted financial group” through close collaboration among our operating companies and flexibly respond to all of the financial needs of our customers, serving society, and fostering shared and sustainable growth for a better world. MUFG’s shares trade on the Tokyo, Nagoya, and New York stock exchanges. About the Mitsubishi Chemical Group Corporation Mitsubishi Chemical Group Corporation (TSE: 4188) is a specialty materials group with an unwavering commitment to lead with innovative solutions to achieve KAITEKI, the well-being of people and the planet. We bring deep expertise and material science leadership in core market segments such as mobility, digital, medical and food. In this way, we enable industry transformation, technology breakthroughs, and longer, more fruitful lives for us all. Together, around 70,000 employees worldwide provide advanced chemistry-based solutions to deliver the core elements of our slogan — “Science. Value. Life.”

Read More

Additive Manufacturing

Teledyne Relays Unveils Innovative Multi-Function Timer Series

Teledyne Relays, Inc. | January 29, 2024

Teledyne Relays, a leading provider of cutting-edge relay solutions, introduces its new Multi-Function Timer product series, showcasing the company's commitment to delivering advanced, reliable, and versatile solutions for the industrial automation sector. Teledyne Relays Multi-Function Timer MFT series is a state-of-the-art solution designed for a wide variety of applications that demand precise timing control. The user-friendly design features three potentiometers for easy selection of timing functions and ranges, while the LEDs provide at-a-glance feedback of timing and relay status. The MFT series also features 7 selectable timing functions for a wide variety of applications Timing ranges from 0.1 seconds up to 100 hours Compact 17.5mm housing preserves valuable panel space Supply Voltages: 24VDC & 24-240VAC OR 12-240VAC/DC 5A SPDT output relay Engineered with the needs of electrical engineers, panel builders, and automation engineers in mind, these timers find application in various industries, including but not limited to Industrial Automation Manufacturing Process Control Systems HVAC and Refrigeration Agriculture and Irrigation Power Distribution “With the new Multi-Function Timer series, Teledyne Relays continues to lead in providing reliable and versatile solutions for industrial automation, ensuring precise timing control,” said Michael Palakian, Vice President of Global Sales and Marketing at Teledyne Relays. The Multi-Function Timer series from Teledyne Relays ensures precise timing control, offering unparalleled reliability across diverse applications and is available for ordering from Teledyne Relays or an authorized distributor. About Teledyne Relays Teledyne Relays is a world leader in high-performance coaxial switches, electromechanical, and solid-state relays, offering a wide range of solutions for various applications in the aerospace and defense, telecommunications, test and measurement, and industrial markets. With over 60 years of experience, Teledyne Relay has established a reputation for quality, reliability, and customer service excellence. About Teledyne Defense Electronics Serving Defense, Space and Commercial sectors worldwide, Teledyne Defense Electronics offers a comprehensive portfolio of highly engineered solutions that meet your most demanding requirements in the harshest environments. Manufacturing both custom and off-the-shelf product offerings, our diverse product lines meet emerging needs for key applications for avionics, energetics, electronic warfare, missiles, radar, satcom, space and test and measurement.

Read More

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